Abstract: The present invention provides for a integrated microwave package that has a non-conductive base having a conductive layer disposed on a first surface thereof and a shielding wall and lid which are grounded to a ground plane that is disposed on a second surface of the non-conductive base. The integrated microwave package for RF, microwave, and millimeter wave signals, as applied to the field of microelectronic and optoelectronic applications, eliminates the need for an external metallic housing and reduces the EMI noise propagation. The integrated microwave package provides a high level of functionality and can be used in high power and high frequency applications that exhibit low insertion loss across a very wide pass band.