Patents by Inventor Clark T. -C Nguyen

Clark T. -C Nguyen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20010033121
    Abstract: Several MEMS-based architectures which utilize vibrating micromechanical resonators in circuits to implement filtering, mixing, frequency reference and amplifying functions are provided. A method and apparatus are provided for upconverting and filtering an information signal utilizing a vibrating micromechanical device based on an AC signal having a desired frequency. One of the primary benefits of the use of such architectures is a savings in power consumption by trading power for high selectivity (i.e., high Q). Consequently, the present invention relies on the use of a large number of micromechanical links in SSI networks to implement signal processing functions with basically zero DC power consumption.
    Type: Application
    Filed: April 20, 2001
    Publication date: October 25, 2001
    Applicant: The Regents of the University of Michigan
    Inventor: Clark T.-C Nguyen
  • Publication number: 20010031025
    Abstract: Several MEMS-based methods and architectures which utilize vibrating micromechanical resonators in circuits to implement filtering, mixing, frequency reference and amplifying functions are provided. For example, a method and apparatus for selecting at least one desired channel in an RF receiver subsystem is shown. One of the primary benefits of the use of such architectures is a savings in power consumption by trading power for high selectivity (i.e., high Q). Consequently, the present invention relies on the use of a large number of micromechanical links in SSI to VLSI networks to implement signal processing functions with basically zero DC power consumption.
    Type: Application
    Filed: April 20, 2001
    Publication date: October 18, 2001
    Applicant: The Regents of the University of Michigan
    Inventor: Clark T.-C. Nguyen
  • Publication number: 20010030489
    Abstract: Several MEMS-based methods and architectures which utilize vibrating micromechanical resonators in circuits to implement filtering, mixing, frequency reference and amplifying functions are provided. A method and apparatus are shown for generating a signal having at least one desired output frequency such as LO frequency in an RF subsystem in response to a tuning voltage and without the need for a phase-locking circuit. One of the primary benefits of the use of such architectures is a savings in power consumption by trading power for high selectivity (i.e., high Q). Consequently, the present invention relies on the use of a large number of micromechanical links in SSI networks to implement signal processing functions with basically zero DC power consumption.
    Type: Application
    Filed: April 20, 2001
    Publication date: October 18, 2001
    Applicant: The Regents of the University of Michigan
    Inventor: Clark T.-C. Nguyen
  • Patent number: 6249073
    Abstract: A flexural-mode, micromechanical resonator utilizing a non-intrusive support structure to achieve measured Q's as high as 8,400 at VHF frequencies from 30-90 MHz is manufactured using polysilicon surface micromachining technology. Also, a method for extending the operating frequency of the resonator as well as other types of micromechanical resonators is disclosed. One embodiment of the method is called a differential-signaling technique. The other embodiment of the method is called a dimple-down technique. The support structure includes one or more torsional-mode support springs in the form of beams that effectively isolate a resonator beam from its anchors via quarter-wavelength impedance transformations, minimizing anchor dissipation and allowing the resonator to achieve high Q with high stiffness in the VHF frequency range. The resonator also includes one or more spacers in the form of dimples formed on the flexural resonator beam or the substrate.
    Type: Grant
    Filed: January 13, 2000
    Date of Patent: June 19, 2001
    Assignee: The Regents of the University of Michigan
    Inventors: Clark T. -C. Nguyen, Michael McCorquodale, Kun Wang
  • Patent number: 6169321
    Abstract: A batch-compatible, post-fabrication annealing method and system are described that can be used to trim the resonance frequency and enhance the quality factor of mechanical microstructures, particularly micromechanical structures, such as micromechanical resonators. The technique involves running a current through a micromechanical structure, or through a nearby microstructure (e.g., a nearby resistor), thereby dissipating power and heating the structure to temperatures high enough to change its microstructure and/or its material properties, which then lead to changes in the microstructure's resonance frequency and quality factor. For micromechanical structures, this technique is particularly useful, since it allows for convenient, simultaneous trimming of many microstructures all at once, and can be implemented via the simple application of a voltage across the anchor points of a micromechanical structure.
    Type: Grant
    Filed: May 5, 1999
    Date of Patent: January 2, 2001
    Assignee: The Regents of the University of Michigan
    Inventors: Clark T. -C Nguyen, Kun Wang
  • Patent number: 5976994
    Abstract: A batch-compatible, post-fabrication annealing method and system are described that can be used to trim the resonance frequency and enhance the quality factor of mechanical microstructures, particularly micromechanical structures, such as micromechanical resonators. The technique involves running a current through a micromechanical structure, or through a nearby microstructure (e.g., a nearby resistor), thereby dissipating power and heating the structure to temperatures high enough to change its microstructure and/or its material properties, which then lead to changes in the microstructure's resonance frequency and quality factor. For micromechanical structures, this technique is particularly useful, since it allows for convenient, simultaneous trimming of many microstructures all at once, and can be implemented via the simple application of a voltage across the anchor points of a micromechanical structure.
    Type: Grant
    Filed: June 13, 1997
    Date of Patent: November 2, 1999
    Assignee: Regents of The University of Michigan
    Inventors: Clark T.- C. Nguyen, Kun Wang
  • Patent number: 5491604
    Abstract: Resonator systems with controlled quality factors including a resonator having a plurality of ports and a first quality factor greater than the system quality factor, and an amplifier providing negative feedback among the ports to render the system quality factor independent of the resonator quality factor.
    Type: Grant
    Filed: December 11, 1992
    Date of Patent: February 13, 1996
    Assignee: The Regents of the University of California
    Inventors: Clark T.-C. Nguyen, Roger T. Howe
  • Patent number: 5455547
    Abstract: A micromechanical filter having planar components, and manufacturable using very large scale integrated circuit microfabrication techniques. The input and output transducers are interdigitated comb electrodes. The mechanical coupling between the input and output transducers includes planar flexures, displacement of the electrodes producing bending of the elements of the flexures. By sealing micromechanical filters in a vacuum and providing on-board circuitry, high signal-to-noise ratios and quality factors are achievable. Construction of a real-time spectrum analyzer using many micromechanical resonators, provides a device with high accuracy and a short sample time.
    Type: Grant
    Filed: October 31, 1994
    Date of Patent: October 3, 1995
    Assignee: The Regents of the University of California
    Inventors: Liwei Lin, Clark T.-C. Nguyen, Roger T. Howe, Albert P. Pisano