Patents by Inventor Clark T. Olsen

Clark T. Olsen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11940340
    Abstract: An apparatus is described. The apparatus may include a substrate and one or more sensors mounted to the substrate. The one or more sensors may be mounted to the substrate using adhesive material and one or more spot welds.
    Type: Grant
    Filed: September 22, 2020
    Date of Patent: March 26, 2024
    Assignee: Hutchinson Technology Incorporated
    Inventors: Clark T. Olsen, Duane M. Jelkin
  • Publication number: 20240068889
    Abstract: A pressure/force sensor comprises a diaphragm structure including a sensing element and a lead structure extending from the diaphragm structure and including first and second traces electrically coupled to the sensing element. The diaphragm structure and the lead structure include a circuit assembly comprising a common insulating layer and a common conductor layer on the insulating layer. The conductor layer includes at least a portion of the sensing element and at least the first trace.
    Type: Application
    Filed: November 9, 2023
    Publication date: February 29, 2024
    Inventors: Michael W. Davis, Peter F. Ladwig, Matthew S. Lang, Dean E. Myers, Clark T. Olsen, Douglas P. Riemer
  • Patent number: 11907790
    Abstract: An identification device includes a first metal layer patterned into a planar coil winding and a second metal layer electrically connected to the first metal layer. The first metal layer is operable to provide a circuit inductance. The second metal layer is patterned to provide one or more overlapping areas with the first metal layer. The second metal layer is operable to provide a circuit capacitance. The identification device includes a dielectric layer separating the first metal layer and the second metal layer.
    Type: Grant
    Filed: September 22, 2020
    Date of Patent: February 20, 2024
    Assignee: Hutchinson Technology Incorporated
    Inventors: Dean E. Myers, Michael W. Davis, Clark T. Olsen, Beauregard J. Gagnon
  • Patent number: 11867575
    Abstract: A pressure/force sensor comprises a diaphragm structure including a sensing element and a lead structure extending from the diaphragm structure and including first and second traces electrically coupled to the sensing element. The diaphragm structure and the lead structure include a circuit assembly comprising a common insulating layer and a common conductor layer on the insulating layer. The conductor layer includes at least a portion of the sensing element and at least the first trace.
    Type: Grant
    Filed: January 28, 2022
    Date of Patent: January 9, 2024
    Assignee: Hutchinson Technology Incorporated
    Inventors: Michael W. Davis, Peter F. Ladwig, Matthew S. Lang, Dean E. Myers, Clark T. Olsen, Douglas P. Riemer
  • Patent number: 11638353
    Abstract: An apparatus is described. The apparatus includes a substrate and one or more sensor components formed on the substrate. And, the apparatus includes one or more electrical circuits formed on the substrate electrically coupled with at least one of the one or more sensor components formed on the substrate.
    Type: Grant
    Filed: September 16, 2019
    Date of Patent: April 25, 2023
    Assignee: Hutchinson Technology Incorporated
    Inventors: Michael W. Davis, Jeffery G. Ribar, Clark T. Olsen
  • Patent number: 11414226
    Abstract: A method of making a component includes applying a clamping force to the component, the component coupled to a carrier strip of a panel via a polymeric tab and separating a portion of the polymeric tab from a substrate of the component, thereby causing the component to be detached from the panel.
    Type: Grant
    Filed: February 21, 2019
    Date of Patent: August 16, 2022
    Assignee: Hutchinson Technology Incorporated
    Inventors: Erich W. Bierbrauer, Scott J. Cray, Peter F. Ladwig, Clark T. Olsen, Zachary A. Pokornowski
  • Publication number: 20220196494
    Abstract: A pressure/force sensor comprises a diaphragm structure including a sensing element and a lead structure extending from the diaphragm structure and including first and second traces electrically coupled to the sensing element. The diaphragm structure and the lead structure include a circuit assembly comprising a common insulating layer and a common conductor layer on the insulating layer. The conductor layer includes at least a portion of the sensing element and at least the first trace.
    Type: Application
    Filed: January 28, 2022
    Publication date: June 23, 2022
    Inventors: Michael W. Davis, Peter F. Ladwig, Matthew S. Lang, Dean E. Myers, Clark T. Olsen, Douglas P. Riemer
  • Patent number: 11243127
    Abstract: A pressure/force sensor comprises a diaphragm structure including a sensing element and a lead structure extending from the diaphragm structure and including first and second traces electrically coupled to the sensing element. The diaphragm structure and the lead structure include a circuit assembly comprising a common insulating layer and a common conductor layer on the insulating layer. The conductor layer includes at least a portion of the sensing element and at least the first trace.
    Type: Grant
    Filed: February 3, 2017
    Date of Patent: February 8, 2022
    Assignee: Hutchinson Technology Incorporated
    Inventors: Michael W. Davis, Peter F. Ladwig, Matthew S. Lang, Dean E. Myers, Clark T. Olsen, Douglas P. Riemer
  • Publication number: 20210356338
    Abstract: An apparatus is described. The apparatus may include a substrate and one or more sensors mounted to the substrate. The one or more sensors may be mounted to the substrate using adhesive material and one or more spot welds.
    Type: Application
    Filed: September 22, 2020
    Publication date: November 18, 2021
    Inventors: Clark T. Olsen, Duane M. Jelkin
  • Publication number: 20210279545
    Abstract: An identification device includes a first metal layer patterned into a planar coil winding and a second metal layer electrically connected to the first metal layer. The first metal layer is operable to provide a circuit inductance. The second metal layer is patterned to provide one or more overlapping areas with the first metal layer. The second metal layer is operable to provide a circuit capacitance. The identification device includes a dielectric layer separating the first metal layer and the second metal layer.
    Type: Application
    Filed: September 22, 2020
    Publication date: September 9, 2021
    Inventors: Dean E. Myers, Michael W. Davis, Clark T. Olsen, Beauregard J. Gagnon
  • Publication number: 20210247218
    Abstract: An apparatus is described. The apparatus including a substrate; one or more sensors and one or more electrical circuits formed on the substrate, the one or more electrical circuits electrically coupled with at least one of the one or more sensors; and a metal layer formed over the sensors, wherein the metal layer is positioned over the one or more sensors to provide a barrier.
    Type: Application
    Filed: September 23, 2020
    Publication date: August 12, 2021
    Inventors: Clark T. Olsen, Michael W. Davis, Douglas P. Riemer, Matthew S. Lang
  • Publication number: 20210247691
    Abstract: A method for producing a component without tabs during etching. The method includes: applying a wafer tape to the plated side of the substrate; depositing a resist layer on a metal layer on a metal side of the substrate that is opposite of the plated side; exposing the resist layer to UV light; developing the resist layer; and etching the metal layer.
    Type: Application
    Filed: February 9, 2021
    Publication date: August 12, 2021
    Inventors: Clark T. Olsen, Jeffery G. Ribar
  • Patent number: 10925663
    Abstract: An apparatus and related methods are described. The apparatus is described that includes a structural metal element including a metallic foam layer. The apparatus also includes a second metal element and a nonmetallic spacer. The nonmetallic spacer arranged between the structural metal element and the second metal element, the metallic foam layer joined to the nonmetallic spacer.
    Type: Grant
    Filed: November 15, 2018
    Date of Patent: February 23, 2021
    Assignee: MOUND LASER & PHOTONICS CENTER, INC.
    Inventors: Michael W. Davis, Douglas P. Riemer, Clark T. Olsen, Steven R. Lagergren, Paul V. Pesavento
  • Publication number: 20200215334
    Abstract: A surgical instrument and related methods are described. The surgical instrument includes a first jaw including a first structural jaw element and a first sealplate fixed to the first structural jaw element and a second jaw including a second structural jaw element and a second sealplate fixed to the second structural jaw element. The second structural jaw element is moveably coupled to the first structural jaw element to facilitate pinching tissue between the first and second sealplates. The first and second sealplates are configured to facilitate sealing tissue pinched therebetween. The first jaw further includes a metallized tie layer between the first sealplate and the first structural jaw element, wherein the first sealplate is fixed to the first structural jaw element via a metal to metal joint between the first sealplate and the metallized tie layer.
    Type: Application
    Filed: March 13, 2020
    Publication date: July 9, 2020
    Inventors: Michael W. Davis, Douglas P. Riemer, Clark T. Olsen, Steven R. Lagergren, Paul V. Pasavento
  • Patent number: 10625083
    Abstract: A surgical instrument and related methods are described. The surgical instrument includes a first jaw including a first structural jaw element and a first sealplate fixed to the first structural jaw element and a second jaw including a second structural jaw element and a second sealplate fixed to the second structural jaw element. The second structural jaw element is moveably coupled to the first structural jaw element to facilitate pinching tissue between the first and second sealplates. The first and second sealplates are configured to facilitate sealing tissue pinched therebetween. The first jaw further includes a metallized tie layer between the first sealplate and the first structural jaw element, wherein the first sealplate is fixed to the first structural jaw element via a metal to metal joint between the first sealplate and the metallized tie layer.
    Type: Grant
    Filed: June 22, 2017
    Date of Patent: April 21, 2020
    Assignee: Hutchinson Technology Incorporated
    Inventors: Michael W. Davis, Douglas P. Riemer, Clark T. Olsen, Steven R. Lagergren, Paul V. Pesavento
  • Publication number: 20200092998
    Abstract: An apparatus is described. The apparatus including a substrate; one or more sensor components formed on the substrate; and one or more electrical circuits formed on the substrate electrically coupled with at least one of the one or more sensor components formed on the substrate.
    Type: Application
    Filed: September 16, 2019
    Publication date: March 19, 2020
    Inventors: Michael W. Davis, Jeffery G. Ribar, Clark T. Olsen
  • Publication number: 20190263550
    Abstract: A method of making a component includes applying a clamping force to the component, the component coupled to a carrier strip of a panel via a polymeric tab and separating a portion of the polymeric tab from a substrate of the component, thereby causing the component to be detached from the panel.
    Type: Application
    Filed: February 21, 2019
    Publication date: August 29, 2019
    Inventors: Erich W. Bierbrauer, Scott J. Cray, Peter F. Ladwig, Clark T. Olsen, Zachary A. Pokornowski
  • Publication number: 20190083166
    Abstract: An apparatus and related methods are described. The apparatus is described that includes a structural metal element including a metallic foam layer. The apparatus also includes a second metal element and a nonmetallic spacer. The nonmetallic spacer arranged between the structural metal element and the second metal element, the metallic foam layer joined to the nonmetallic spacer.
    Type: Application
    Filed: November 15, 2018
    Publication date: March 21, 2019
    Inventors: Michael W. Davis, Douglas P. Riemer, Clark T. Olsen, Steven R. Lagergren, Paul V. Pesavento
  • Publication number: 20170368357
    Abstract: A surgical instrument and related methods are described. The surgical instrument includes a first jaw including a first structural jaw element and a first sealplate fixed to the first structural jaw element and a second jaw including a second structural jaw element and a second sealplate fixed to the second structural jaw element. The second structural jaw element is moveably coupled to the first structural jaw element to facilitate pinching tissue between the first and second sealplates. The first and second sealplates are configured to facilitate sealing tissue pinched therebetween. The first jaw further includes a metallized tie layer between the first sealplate and the first structural jaw element, wherein the first sealplate is fixed to the first structural jaw element via a metal to metal joint between the first sealplate and the metallized tie layer.
    Type: Application
    Filed: June 22, 2017
    Publication date: December 28, 2017
    Inventors: Michael W. Davis, Douglas P. Riemer, Clark T. Olsen, Steven R. Lagergren, Paul V. Pesavento
  • Publication number: 20170219443
    Abstract: A pressure/force sensor comprises a diaphragm structure including a sensing element and a lead structure extending from the diaphragm structure and including first and second traces electrically coupled to the sensing element. The diaphragm structure and the lead structure include a circuit assembly comprising a common insulating layer and a common conductor layer on the insulating layer. The conductor layer includes at least a portion of the sensing element and at least the first trace. In embodiments the sensing element includes electrodes. In other embodiments the sensing element includes a strain gauge.
    Type: Application
    Filed: February 3, 2017
    Publication date: August 3, 2017
    Inventors: Michael W. Davis, Peter F. Ladwig, Matthew S. Lang, Dean E. Myers, Clark T. Olsen, Douglas P. Riemer