Abstract: An electronic assembly includes a chassis having electronic module mounting positions. The electronic assembly also includes a respective electronic module received in each electronic module mounting position and having a module cooling gas passageway. Each electronic module has a module glide surface. The electronic assembly includes a respective sealing retainer coupled between the chassis and each electronic module. The sealing retainer has a cooling gas passageway aligned with a chassis cooling gas passageway and the module cooling gas passageway. The sealing retainer includes a retainer body having a retainer glide surface, and a gas sealing gasket carried by the retainer body. The module glide surface and the retainer glide surface have respective cooperating features so that the respective electronic module is maintained in spaced relation from the sealing gasket as the respective electronic module is slidably inserted into a seated position.

Abstract: Systems and methods. The methods comprise: causing bellows to transition from expanded states to collapsed states by removing a first fluid therefrom (the bellows being coupled to opposing sidewalls of a chassis configured to structurally support at least one circuit card); receiving the at least one circuit card in a cavity of the chassis; causing the bellows to transition from the collapsed states to at least partially expanded states by allowing the first fluid to enter the bellows; applying a pushing force by each said bellow to an intermediary structure disposed between the bellow and the circuit card; and creating a seal between the intermediary structure and the circuit card when the bellow is in the at least partially expanded state.

Abstract: Systems and methods for facilitating temperature regulation of an electronic module. The methods comprise: coupling first heat exchanger modules of a plurality of heat exchanger modules together to form a first set of heat exchanger modules and second heat exchanger modules of the plurality of heat exchanger modules together to form a second set of heat exchanger modules; using frame members to structurally support and maintain the first and second sets of heat exchanger modules in a spaced apart arrangement; and providing at least one slot between corresponding spaced apart modules of the first and second heat exchanger modules, the at least one slot being sized and shaped to receive the electronic module to facilitate the temperature regulation via the plurality of heat exchanger modules.

Abstract: Systems and methods for making an interconnect device for electronic circuits. The methods comprise: fabricating a housing as a single 3D printed part having a plurality of apertures with bend angles less than ninety degrees; inserting wires into the plurality of apertures of the housing; and establishing electrical connections respectively between (A) the wires and a plurality of first socket adaptors and (B) the wires and a plurality of second socket adaptors.

Abstract: An electronic assembly includes a chassis having electronic module mounting positions. The electronic assembly also includes a respective electronic module received in each electronic module mounting position and having a module cooling gas passageway. Each electronic module has a module glide surface. The electronic assembly includes a respective sealing retainer coupled between the chassis and each electronic module. The sealing retainer has a cooling gas passageway aligned with a chassis cooling gas passageway and the module cooling gas passageway. The sealing retainer includes a retainer body having a retainer glide surface, and a gas sealing gasket carried by the retainer body. The module glide surface and the retainer glide surface have respective cooperating features so that the respective electronic module is maintained in spaced relation from the sealing gasket as the respective electronic module is slidably inserted into a seated position.

Abstract: Systems and methods. The methods comprise: causing bellows to transition from expanded states to collapsed states by removing a first fluid therefrom (the bellows being coupled to opposing sidewalls of a chassis configured to structurally support at least one circuit card); receiving the at least one circuit card in a cavity of the chassis; causing the bellows to transition from the collapsed states to at least partially expanded states by allowing the first fluid to enter the bellows; applying a pushing force by each said bellow to an intermediary structure disposed between the bellow and the circuit card; and creating a seal between the intermediary structure and the circuit card when the bellow is in the at least partially expanded state.

Abstract: A module is retained in a slot of an electronics chassis. A clearance space is provided for receiving the module in a slot of the electronics chassis by controlling an internal pressure of a bellows. The bellows forms a part of a retainer that is disposed on an elongated rail extending along a length of the slot. The bellows defines an internal bellows capsule which contains a fluid. Once the module has been inserted in the slot, the module is secured with the retainer by further controlling the internal pressure of the bellows to exert a force on the module.

Abstract: Systems and methods for providing a fin structure. The fin structure may be employed in a heat exchanger. The fin structure comprises: a support structure; and a plurality of fins disposed on the support structure via additive manufacturing so as to facilitate a change in direction of a fluid flowing through the fin structure. The fins comprise first fins that have centers arranged in accordance with a phyllotaxis or Fibonacci pattern.

Abstract: Systems and methods for making an interconnect device for electronic circuits. The methods comprise: fabricating a housing as a single 3D printed part having a plurality of apertures with bend angles less than ninety degrees; inserting wires into the plurality of apertures of the housing; and establishing electrical connections respectively between (A) the wires and a plurality of first socket adaptors and (B) the wires and a plurality of second socket adaptors.

Abstract: Systems and methods for making an interconnect device for electronic circuits. The methods comprise: fabricating a housing as a single 3D printed part having a plurality of apertures with bend angles less than ninety degrees; inserting wires into the plurality of apertures of the housing; and establishing electrical connections respectively between (A) the wires and a plurality of first socket adaptors and (B) the wires and a plurality of second socket adaptors.

Abstract: Systems and methods for making an interconnect device for electronic circuits. The methods comprise: fabricating a housing as a single 3D printed part having a plurality of apertures with bend angles less than ninety degrees; inserting wires into the plurality of apertures of the housing; and establishing electrical connections respectively between (A) the wires and a plurality of first socket adaptors and (B) the wires and a plurality of second socket adaptors.