Abstract: A method and apparatus for heat treating objects in an enclosure, where the enclosure has an inlet passage, an outlet passage, and a treatment zone. Gaseous first fluid is injected into the treatment zone and the objects to be treated are passed through the treatment zone. A second fluid, with a density greater than that of the first fluid, is injected near the inlet and outlet passages.

Abstract: The process is carried out in an enclosure (21) located in a surrounding gaseous fluid and defining an internal treatment zone (31). The enclosure (21) comprises an entrance passage (32) and an exit passage (33). This process comprises the following steps: (a) the treatment zone (31) is heated; (b) a gaseous treatment fluid is injected into the treatment zone (31); (c) the said objects (12) are transported through the said treatment zone (31); (d) a gaseous isolating fluid is injected in the vicinity of at least one of the said passages (32, 33). In step (d), the density of the said gaseous isolating fluid at the temperature found in the one or more of the said passages (32, 33) is greater than the density of the gaseous treatment fluid inside the oven. Applicable to the assembling of electronic boards by soldering.

Abstract: This invention is related to a method for encapsulating bond regions in electronic components comprising, for example, metallic bond regions, the method comprising the steps of exposing an electronic component having at least one bond region through a primary gas atmosphere comprising unstable or excited gaseous species, the gaseous species being substantially devoid of any electrical charges, the primary gas atmosphere having a pressure ranging from about 0.5×105 Pa to about 3.0×105 Pa, thereby forming a treated, non-encapulated electronic component, then encapsulating the electronic component.

Abstract: This invention is related to a method for encapsulating bond regions in electronic components comprising, for example, metallic bond regions, the method comprising the steps of exposing an electronic component having at least one bond region through a primary gas atmosphere comprising unstable or excited gaseous species, the gaseous species being substantially devoid of any electrical charges, the primary gas atmosphere having a pressure ranging from about 0.5×105 Pa to about 3.0×105 Pa, thereby forming a treated, non-encapulated electronic component, then encapsulating the electronic component.

Abstract: This invention is related to a method for encapsulating bond regions in electronic components comprising, for example, metallic bond regions, the method comprising the steps of exposing an electronic component having at least one bond region through a primary gas atmosphere comprising unstable or excited gaseous species, the gaseous species being substantially devoid of any electrical charges, the primary gas atmosphere having a pressure ranging from about 0.5×105 Pa to about 3.0×105 Pa, thereby forming a treated, non-encapulated electronic component, then encapsulating the electronic component.

Abstract: This invention is related to a method for encapsulating bond regions in electronic components comprising, for example, metallic bond regions, the method comprising the steps of exposing an electronic component having at least one bond region through a primary gas atmosphere comprising unstable or excited gaseous species, the gaseous species being substantially devoid of any electrical charges, the primary gas atmosphere having a pressure ranging from about 0.5×105 Pa to about 3.0×105 Pa, thereby forming a treated, non-encapulated electronic component, then encapsulating the electronic component.

Abstract: There is proposed as a plasma-producing gas, a gas containing the elements nitrogen and oxygen chemically combined in a nitrogen oxide and in particular nitrous oxide. These plasma-producing gases or mixture of gases stored in a bottle, a frame, a container, a tank, in the gaseous or liquid form at ambient or cryogenic temperature, are applicable to the plasma arc cutting of electrically conductive materials.

Abstract: An electron beam welding chamber for butt joining elongate members 1,2 extending longitudinally at the center of the chamber. The chamber comprises an envelope 7 defining the welding enclosure 6 and which rests on a fixed structure 8. The electron gun equipment 13 is provided within the envelope and is mechanically connected, by a withdrawable connection means 18 or by elastic connection means 24, 25, to the enclosure, clamping means 15 being provided for clamping the electron gun equipment relative to one of the elongate members. This invention is particularly applicable to the welding of the sections of a pipe to be laid on the sea bed.

Abstract: A welding chamber in which a vacuum is created for welding, using an electron beam, elongate pieces extending centrally of the chamber. The welding chamber is divided into a central sub-enclosure 41 for receiving the pieces 1, 2 to be welded and which is evacuated during welding, and a peripheral sub-enclosure 42 in which the welding means are located and which is permanently evacuated, the two sub-enclosures being separated by retractable sealing gaskets 12, 26, 27 which are retracted during welding to place the two sub-enclosures in communication.