Abstract: Disclosed is a method for the mounting, on an flexible substrate, of miniature electronic components of the beam lead type. Said method consists, after a first connection lead of a component has been soldered to the substrate, in arching each of the other connection leads of the component considered during their soldering by pressing the connection lead considered on a metallized zone of the substrate by means of a tip of a soldering tool while, at the same time, making a approaching movement towards the body of the component considered with this tip before carrying out the soldering operation itself. Through this mounting method, the beam lead electronic components are no longer placed flat against the substrate with their connection leads in an extended position but are arched on these leads. This gives them a freedom of play that enables them to absorb mechanical stresses by adopting positions of greater flatness or lesser flatness on the substrate.