Abstract: An active composite consists of a compressed support and an agent which reacts with a gas. According to the invention, the compressed support comprises recompressed expanded graphite having a density between 0.02 and 1.5. A process for implementing gas-solid type reactions in which said active composite is used as the reaction medium is also described.

Abstract: The disclosure relates to insulated metal substrates and to a process for producing these substrates. These substrates have an aluminium base, an insulant constituted by an alumina film obtained by anodizing at least one of the faces of said base and at least one metal film which is to be transformed by chemical etching into a network of conductors. The alumina film is formed by a uniform compact zone adhering to the aluminium and having a thickness in excess of 500 nm and a porous layer with a rough outer surface. The process of making these substrates includes a step during which at least one of the faces of the aluminium base undergoes a treatment in a porous anodization layer forming bath and then in a barrier anodization layer forming bath. The invention is used in the production of substrates for single face, double face, with metallized holes, and multilayer conductive circuits. The substrates produced have a planar or non-planar configuration, and may also have resistive networks.

Abstract: The disclosure relates to insulated metal substrates and to a process for producing these substrates. These substrates have an aluminium base, an insulant constituted by an alumina film obtained by anodizing at least one of the faces of said base and at least one metal film which is to be transformed by chemical etching into a network of conductors. The alumina film is formed by a uniform compact zone adhering to the aluminium and having a thickness in excess of 500 nm and a porous layer with a rough outer surface. The process of making these substrates includes a step during which at least one of the faces of the aluminium base undergoes a treatment in a porous anodization layer forming bath and then in a barrier anodization layer forming bath. The invention is used in the production of substrates for single face, double face, with metallized holes, and multilayer conductive circuits. The substrates produced have a planar or non-planar configuration, and may also have resistive networks.

Abstract: A multi-layer material comprises at least two layers of flexible material, including one layer based on electrically conductive, expanded recompressed graphite and another layer based on a metal, wherein the layer of graphite has at least one face thereof covered at every point by a layer of metal and in direct electrical contact with the layer of metal, and wherein the layer of metal is obtained by electrodeposition or by chemical deposit of at least one metal on the layer of graphite in such a way that the layer of metal adheres directly to the layer of graphite and closely matches the micro-relief thereof.

Abstract: The invention comprises a process for co-sintering of conductors of copper or copper-based alloy and a ceramic substrate, the substrate being produced from a ceramic powder of cordierite type, having a sintering temperature of lower than 950.degree. C.The process comprises the following steps:(a) shaping of the ceramic substrate from a powder of cordierite type,(b) deposit of copper on the ceramic substrate, and(c) co-sintering heat treatment, during which the organic compounds are removed, the copper is regenerated in a reducing atmosphere, and co-sintering of the conductors and the substrate is carried out in a flow of moist inert gas with a plateau at a temperature of between 1065.degree. and 1080.degree. C.The process according to the invention makes it possible to produce substrates of cordierite with internal and external conductors.