Patents by Inventor Claude Escoffre

Claude Escoffre has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic package assembly
    Patent number: 6841869
    Abstract: An electronic package assembly includes a number of semiconductor devices with first and second sides. A printed circuit substrate has a number of printed circuit patterns bonded to conductive pads of the first sides of the devices. A metal leadframe includes leads which provide external connections for the package assembly, and also includes a non-lead island portion bonded to conductive pads of the second sides of the devices. In this way the island portion of the leadframe forms an interconnection between the second sides of the devices.
    Type: Grant
    Filed: June 21, 1999
    Date of Patent: January 11, 2005
    Assignee: Motorola, Inc.
    Inventors: Markos Triantafyllou, Will Specks, Claude Escoffre