Abstract: A low-cost header for connecting an electronic components board to a circuit board is disclosed, consisting of side walls made of an unwarpable plastic material and joined together to form a frame around an area substantially the same as the area of the components board. A plurality of metal pins are located in the frame, each having one end extending from said frame such that these ends can be soldered to the components board concurrently with the solder attachment of the components to the board. The other ends of the pins can be formed so that they are adjusted for either through-hole attachment to circuit boards, or for surface mounting.

Abstract: A low-cost header for connecting an electronic components board to a circuit board is disclosed, consisting of side walls made of an unwarpable plastic material and joined together to form a frame around an area substantially the same as the area of the components board. A plurality of metal pins are located in the frame, each having one end extending from said frame such that these ends can be soldered to the components board concurrently with the solder attachment of the components to the board. The other ends of the pins can be formed so that they are adjusted for either through-hole attachment to circuit boards, or for surface mounting.

Abstract: A low-cost header for connecting an electronic components board to a circuit board is disclosed, consisting of side walls made of an unwarpable plastic material and joined together to form a frame around an area substantially the same as the area of the components board. A plurality of metal pins are located in the frame, each having one end extending from said frame such that these ends can be soldered to the components board concurrently with the solder attachment of the components to the board. The other ends of the pins can be formed so that they are adjusted for either through-hole attachment to circuit boards, or for surface mounting.

Abstract: A low-cost header for connecting an electronic components board to a circuit board is disclosed, consisting of side walls made of an unwarpable plastic material and joined together to form a frame around an area substantially the same as the area of the components board. A plurality of metal pins are located in the frame, each having one end extending from said frame such that these ends can be soldered to the components board concurrently with the solder attachment of the components to the board. The other ends of the pins can be formed so that they are adjusted for either through-hole attachment to circuit boards, or for surface mounting.

Abstract: The heat sink is mounted on a back plane of an auxiliary circuit board and the auxiliary circuit board is mounted on a main circuit board. In one embodiment, the heat sink is planer and extends between parallel auxiliary and main circuit boards. A finned heat dissipating member is at one side of the planar portion. Mounting pins in channels mount the heat sink to the main circuit board. The second embodiment is u-shaped and stands on edge to mount the auxiliary circuit board perpendicular to the main circuit boards. Mounting pins in channels of the second embodiment likewise mount the heat sink to the main circuit board.

Abstract: A housing for a toroid coil has side walls closely formed around the coil and a top connected at a gap from the side walls by attachments. The top provides a flat, relatively smooth vacuum pick up surface for mounting the coil on a circuit board and is removable by breaking off the attachments. The side walls have a front wall with wire wrap posts extending therefrom positioned so that the wire of the coil lies in the mounting plane for surface mount connection when wrapped on the posts. Slots are provided in the front wall to receive the wire to prevent cutting or scoring of the wire or its coating or cover during removal of the top. The back of the walls is open to reduce length and thickened supports are provided at the edges of the walls adjacent the back.

Abstract: The heat sink is mounted on a back plane of an auxiliary circuit board and the auxiliary circuit board is mounted on a main circuit board. In one embodiment, the heat sink is planer and extends between parallel auxiliary and main circuit boards. A finned heat dissipating member is at one side of the planar portion. Mounting pins in channels mount the heat sink to the main circuit board. The second embodiment is u-shaped and stands on edge to mount the auxiliary circuit board perpendicular to the main circuit boards. Mounting pins in channels of the second embodiment likewise mount the heat sink to the main circuit board.

Abstract: The heat sink is mounted on a back plane of an auxiliary circuit board and the auxiliary circuit board is mounted on a main circuit board. In one embodiment, the heat sink is planer and extends between parallel auxiliary and main circuit boards. A finned heat dissipating member is at one side of the planar portion. Mounting pins in channels mount the heat sink to the main circuit board. The second embodiment is unshaped and stands on edge to mount the auxiliary circuit board perpendicular to the main circuit boards. Mounting pins in channels of the second embodiment likewise mount the heat sink to the main circuit board.

Abstract: A pinball machine is provided and includes an inclined playfield for supporting a rolling ball. The inclined playfield has associated therewith at least one flipper, an exit lane, and a drain hole. A door mechanism having a retractable door is positioned adjacent to the exit lane and a holding area is positioned behind the door for allowing a ball to be stored therein whereby the ball is prevented from continuing down the exit lane and into the drain hole. A kicker mechanism is also associated with the holding area for launching the ball from the holding area back through the exit lane and into the play area of the playfield. A first switch is positioned upon the playfield and is operable through contact with the ball for causing the door to move from a first position wherein the ball is prevented from accessing the holding area to a second position wherein the ball is allowed to access the holding area.

Abstract: A gaming machine combines a random selection feature with a skill feature to allow the player to utilize his ability to manipulate the skill feature to improve his chances of winning on the gaming machine. A reel slot machine is combined with a playing surface using a ball. The reel slot machine is first activated and a combination of slot symbols are randomly selected. The player manipulates a ball about a playing surface and the travel of the ball can result in additional spins of one or more reels of the slot machine so that other winning opportunities can be created. The gaming machine can be operated so that the playing surface is only activated when the player achieves a losing combination on the reel slot machine portion. This allows the player a second chance to win if he can use his skill on the playing surface to respin the reel slots. The player can also win "bonus" amounts as set out on a predetermined schedule of payouts by his skillful manipulation of the ball on the playing surface.