Abstract: A method of mounting electrical component assemblies on opposite sides of a printed circuit card including inserting a chock on a first side of the printed circuit card; inserting a standoff and placing a spring around each standoff; pressing the chock against the printed circuit card; mounting a first electrical component assembly on a second side of the printed circuit card; placing a package tool having a plurality of springs on a horizontal support so that when the first mounted electrical component assembly is placed inside the package tool the springs of the package tool come into contact with the first electrical component assembly; removing the chock from the printed circuit card such that the springs of the package tool compensate for the weight of the first electrical component assembly inside the package tool; and mounting a second electrical component assembly on the first side of the printed circuit card.

Abstract: A device for at least two electronic components disposed opposite each other and on each side of the same connection board by application of pressure. At least one small clamping column is arranged to be slid into an opening provided in the connection board, and to receive, at each of its ends, a spring which causes a resilient bracing force to be exerted on a bearing plate in the direction of the connection board. Clamping abutments serve to clamp the clamping column to the connection board. Each clamping column is disposed on each side of the connection board, and spaced from each other by a distance strictly greater than the thickness of the board so as to provide between the board and the abutments a clearance for balancing the retaining force between the two bearing plates.

Abstract: The subject of the present invention is a device (1) for mounting at least two electrical components (4A, 4B) on a printed circuit card (2), the card (2) comprising connection pads on both of its sides. According to the invention, the card (2) is traversed by holes (11-14) for receiving mounting means that extend through the printed circuit card in order to mount the electrical components (4A, 4B) on opposite sides of the card. Another subject of the invention is the tool (35) for mounting or removing an electrical component mounted on a printed circuit card as mentioned above. This tool comprises means for exerting pressure on a first electrical component (4A) attached to a first side of the printed circuit card, in order to mount or remove a second electrical component (4B) on the opposite side of the printed circuit card (2).

Abstract: The subject of the present invention is a device (1) for mounting at least two electrical components (4A, 4B) on a printed circuit card (2), the card (2) comprising connection pads on both of its sides. According to the invention, the card (2) is traversed by holes (11-14) for receiving mounting means that extend through the printed circuit card in order to mount the electrical components (4A, 4B) on opposite sides of the card. Another subject of the invention is the tool (35) for mounting or removing an electrical component mounted on a printed circuit card as mentioned above. This tool comprises means for exerting pressure on a first electrical component (4A) attached to a first side of the printed circuit card, in order to mount or remove a second electrical component (4B) on the opposite side of the printed circuit card (2).

Abstract: A device for retaining by pressure at least two electronic components disposed opposite each other and on each side of the same connection board.

Abstract: The subject of the present invention is a device (1) for mounting at least two electrical components (4A, 4B) on a printed circuit card (2), the card (2) comprising connection pads on both of its sides. According to the invention, the card (2) is traversed by holes (11-14) for receiving mounting means that extend through the printed circuit card in order to mount the electrical components (4A, 4B) on opposite sides of the card. Another subject of the invention is the tool (35) for mounting or removing an electrical component mounted on a printed circuit card as mentioned above. This tool comprises means for exerting pressure on a first electrical component (4A) attached to a first side of the printed circuit card, in order to mount or remove a second electrical component (4B) on the opposite side of the printed circuit card (2).

Abstract: The present invention concerns a package for an integrated circuit (3) of the type comprising a cavity (2) in which the integrated circuit (3) is mounted, the active surface (10) of the integrated circuit (3) being electrically connected to the package on the level of connection (Nc) of an array of balls (13i) to the package, providing a mechanical and electrical link between the integrated circuit (3) and a printed circuit card to which the package must be assembled. It is characterized in that it comprises an additional layer (14) that is rigid and electrically neutral, mounted on the level of connection (Nc) of the integrated circuit (3) and the balls (13i) and containing the balls (13i). It particularly applies to the connections of BGA and PBGA packages.