Abstract: A refrigerator is wall-mounted. The refrigerator has a frame with an insulated compartment supporting a plurality of shelves, a front panel covering the frame and having at least one window for displaying refrigerated articles supported by the shelves, at least one door to access the articles supported by the shelves, a cooling unit, an air recirculation system having a warm air collector for collecting warm air and having a warm air channel for directing air through the cooling unit to provide cooled air, at least one fan, and a cold air channel for directing the cooled air back into the compartment and a mounting for anchoring the refrigerator with respect to a wall. The thermal efficiency of the refrigerator may be enhanced as described herein.

Abstract: A high efficiency thermoelectric cooling system and method is described. The cooling system has a thermoelectric module having a semi-conductor body sandwiched in contact between a pair of thermally conductive plates. A smooth continuous variable output direct current source supplies the semi-conductor body to attenuate thermal stress in the conductive plates due to temperature differential fluctuation across the plates. Current flow in the semi-conductor body transfers heat from one plate to the other plate. A cold heat sink absorbs heat from the cold plate. A heat convection assembly, including a hot heat sink, evacuates heat from the hot plate. The thermoelectric cooling device is secured to a wall of an insulated enclosure. An air convection housing may b provided to evacuate heat from the hot heat sink using an outside air supply or ambient air supply.

Abstract: A high efficiency thermoelectric cooling system and method is described. The cooling system comprises a thermoelectric module having a semi-conductor body sandwiched in contact between a pair of thermally conductive plates. A power supply having converter circuit means provides a smooth continuous variable output direct current supply to the semi-conductor body to attenuate thermal stress in the conductive plates due to temperature differential fluctuation across the plates. One of the plates is a cold plate and the other a hot plate caused by current flow in the semi-conductor body transferring heat from the cold plate to the hot plate. A cold heat sink is associated with the cold plate to absorb heat from the insulted enclosure to cool the enclosure. A heat convection assembly including a hot heat sink evacuates heat from the hot plate to effectively manage the temperature differential across the plates.