Patents by Inventor Claude Rathmell

Claude Rathmell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of making three dimensional integrated circuit interconnect module
    Patent number: 5383269
    Abstract: A three dimensional integrated circuit interconnect for connecting a plurality of chips in a module with a standard footprint for pin grid array or quad flat pack mounting. Each IC is mounted on a custom interconnect slice and tested. The slices are stacked together with electrical connections from one slice layer to the next. The module may use multi-layer ceramic slices or printed circuit board materials.
    Type: Grant
    Filed: September 2, 1993
    Date of Patent: January 24, 1995
    Assignee: Microelectronics And Computer Technology Corporation
    Inventors: Claude Rathmell, Carroll S. Vance, David W. Barnes, Seyed H. Hashemi