Abstract: The present invention relates to an electronic system comprising an electronic system comprising an electromechanical microsystem and a hermetic box encapsulating said microsystem. The box includes a fastening plane. The electromechanical microsystem includes a sensitive part and at least two beams connecting the sensitive part to the fastening plane. The beams are thermally coupled to the sensitive part and are electrically coupled to one another. The system further includes a thermal regulator of the electromechanical microsystem including an electrical circuit including at least two ends connected to the beams, and a circuit controller able to generate an electrical current in the electrical circuit to modify the temperature of the sensitive part.

Abstract: The present invention relates to an electronic system comprising an electronic system comprising an electromechanical microsystem and a hermetic box encapsulating said microsystem. The box includes a fastening plane. The electromechanical microsystem includes a sensitive part and at least two beams connecting the sensitive part to the fastening plane. The beams are thermally coupled to the sensitive part and are electrically coupled to one another. The system further includes a thermal regulator of the electromechanical microsystem including an electrical circuit including at least two ends connected to the beams, and a circuit controller able to generate an electrical current in the electrical circuit to modify the temperature of the sensitive part.

Abstract: A vibrating inertial sensor is provided, micro machined in a plane thin wafer, allowing the measurement of an angular position or of an angular speed. The sensor comprises two vibrating masses suspended by springs with identical stiffness in X and Y and coupled together by identical stiffness springs in X and Y, and at least excitation transducers and detection transducers disposed on at least one of the masses. The mobile assembly consisting of a vibrating mass and the parts of transducers fastened to this mass has a generally symmetric structure with respect to an axis of symmetry OX and with respect to an axis of symmetry OY.

Abstract: A vibrating inertial sensor is provided, micro machined in a plane thin wafer, allowing the measurement of an angular position or of an angular speed. The sensor comprises two vibrating masses suspended by springs with identical stiffness in X and Y and coupled together by identical stiffness springs in X and Y, and at least excitation transducers and detection transducers disposed on at least one of the masses. The mobile assembly consisting of a vibrating mass and the parts of transducers fastened to this mass has a generally symmetric structure with respect to an axis of symmetry OX and with respect to an axis of symmetry OY.

Abstract: The invention relates to a microgyroscope, that is to say an inertial micromechanical sensor dedicated to the measurement of angular velocities, which is produced by micromachining techniques, and has a novel arrangement of the modules for measuring the movement of the vibrating masses. The gyroscope comprises two symmetrical moving assemblies (30, 50; 30?, 50?) that are coupled by a coupling structure (20, 20?, 22). Each of the two assemblies comprises a moving mass (30) surrounded by a moving intermediate frame (50). The frame (50) is connected to the coupling structure (20, 20?, 22) and can vibrate in two degrees of freedom in orthogonal directions Ox and Oy of the plane of the wafer. The mass (30) is connected, on one side, to the frame and, on the other side, to fixed anchoring regions (34, 36) via linking means (40-46; 52-58) that allow the vibration movement in the Oy direction to be transmitted to the mass without permitting any movement of the mass in the Ox direction.

Abstract: The invention relates to a microgyroscope, that is to say an inertial micromechanical sensor dedicated to the measurement of angular velocities, which is produced by micromachining techniques, and has a novel arrangement of the modules for measuring the movement of the vibrating masses. The gyroscope comprises two symmetrical moving assemblies (30, 50; 30?, 50?) that are coupled by a coupling structure (20, 20?, 22). Each of the two assemblies comprises a moving mass (30) surrounded by a moving intermediate frame (50). The frame (50) is connected to the coupling structure (20, 20?, 22) and can vibrate in two degrees of freedom in orthogonal directions Ox and Oy of the plane of the wafer. The mass (30) is connected, on one side, to the frame and, on the other side, to fixed anchoring regions (34, 36) via linking means (40-46; 52-58) that allow the vibration movement in the Oy direction to be transmitted to the mass without permitting any movement of the mass in the Ox direction.

Abstract: The invention relates to a gyrometer based on a vibrating structure, produced by micromachining in a thin planar wafer. It comprises four moving assemblies placed at the vertices of a virtual rectangle, each moving assembly being coupled to two moving assemblies located at neighboring vertices via a coupling structure and comprising an inertial first moving element connected to the coupling structure and intended to vibrate in two orthogonal directions in the plane of the wafer, namely an excitation direction and a detection direction, and a second moving element intended to vibrate in the detection direction and connected, on one side, to the first moving element and, on the other side, to anchoring zones via linking means.

Abstract: The invention relates to a micromachined gyrometer having a planar moving structure anchored on a fixed substrate by anchoring feet, the fixed substrate being mounted on a support substrate via fasteners, the moving structure comprising at least two moving assemblies that are symmetrical with respect to an axis of symmetry A1; the anchoring feet are located outside this axis A1. The fixed substrate has etched features for the purpose of partly isolating at least one region from the rest of the fixed substrate, this region having a portion of the fixed substrate that includes at least one anchoring foot, and the fixed substrate is mounted on the support substrate via fasteners applied outside the region.

Abstract: The invention relates to gyroscopes having a vibrating structure that is micromachined in a silicon substrate. A novel vibrating structure is described, which has two moving masses 14 and 14?, connected by a vibration energy coupling structure (transverse arms 26, 26?, longitudinal arms 22, 22?, and a short transverse link 24 between the longitudinal links 22, 22?). The moving masses are also suspended from U-shaped flexure arms (13), having one branch end connected to the mass and another end connected to a fixed anchoring point 18. The flexure arms are not inserted between the coupling structure and the mass, but are independent of the coupling structure. The masses are excited so as to vibrate in their plane by electrostatic forces applied by interdigitated combs 11. The Coriolis forces make them vibrate perpendicular to the plane, and this vibration is detected by electrodes forming part of the moving masses.

Abstract: The invention relates to a microgyroscope, that is to say an inertial micromechanical sensor dedicated to the measurement of angular velocities, which is produced by micromachining techniques on a silicon wafer. The gyroscope comprises two symmetrical moving assemblies coupled via a coupling structure. Each of the two assemblies comprises a moving mass surrounded by a moving intermediate frame. The frame is connected to the coupling structure and can vibrate in two degrees of freedom in orthogonal directions Ox and Oy in the plane of the wafer. The mass is connected on one side to the frame and on the other side to fixed anchoring regions via linking means that allow the vibration movement along the Oy direction to be transmitted to the mass without permitting movement of the mass along the Ox direction. An excitation structure is associated with the frame in order to excite its vibration along Ox. A movement detection structure is associated with the mass in order to detect its vibration along Oy.

Abstract: Accelerometer micromachined in a plane plate comprising a base, and at least one measurement cell including a moveable seismic mass connected to the base and capable of moving translationally along the sensitive y axis of the accelerometer under the effect of an acceleration ? along this y axis, a resonator cell that comprises a resonator that can vibrate and be subjected to a tensile or compressive force depending on the direction of the acceleration ? and is placed symmetrically with respect to an axis of symmetry S of the structure, this axis S being parallel to the y axis and passing through the center of gravity of the seismic mass, the measurement cell furthermore including amplification means for amplifying the acceleration force, which means comprise at least one anchoring foot for anchoring to the base, two rigid terminations of the resonator cell and two pairs of micromachined arms symmetrical with respect to the axis S, each pair comprising a first arm connecting a termination to the seismic mass,

Abstract: The invention relates to a differential accelerometer micromachined in a plane plate, comprising a base and a differential measurement cell which includes a moveable seismic mass and two force sensors that are connected to the mass and to the base.

Abstract: Accelerometer micromachined in a plane plate comprising a base, and at least one measurement cell including a moveable seismic mass connected to the base and capable of moving translationally along the sensitive y axis of the accelerometer under the effect of an acceleration ? along this y axis, a resonator cell that comprises a resonator that can vibrate and be subjected to a tensile or compressive force depending on the direction of the acceleration ? and is placed symmetrically with respect to an axis of symmetry S of the structure, this axis S being parallel to the y axis and passing through the center of gravity of the seismic mass, the measurement cell furthermore including amplification means for amplifying the acceleration force, which means comprise at least one anchoring foot for anchoring to the base, two rigid terminations of the resonator cell and two pairs of micromachined arms symmetrical with respect to the axis S, each pair comprising a first arm connecting a termination to the seismic mass,

Abstract: The invention relates to a microgyroscope, that is to say an inertial micromechanical sensor dedicated to the measurement of angular velocities, which is produced by micromachining techniques on a silicon wafer. The gyroscope comprises two symmetrical moving assemblies coupled via a coupling structure. Each of the two assemblies comprises a moving mass surrounded by a moving intermediate frame. The frame is connected to the coupling structure and can vibrate in two degrees of freedom in orthogonal directions Ox and Oy in the plane of the wafer. The mass is connected on one side to the frame and on the other side to fixed anchoring regions via linking means that allow the vibration movement along the Oy direction to be transmitted to the mass without permitting movement of the mass along the Ox direction. An excitation structure is associated with the frame in order to excite its vibration along Ox. A movement detection structure is associated with the mass in order to detect its vibration along Oy.

Abstract: The invention relates to a differential accelerometer micromachined in a plane plate, comprising a base and a differential measurement cell which includes a moveable seismic mass and two force sensors that are connected to the mass and to the base.

Abstract: The invention relates to a micromachined gyrometer having a planar moving structure anchored on a fixed substrate by anchoring feet, the fixed substrate being mounted on a support substrate via fastening means, the moving structure comprising at least two moving assemblies that are symmetrical with respect to an axis of symmetry A1; the anchoring feet are located outside this axis A1. The fixed substrate has etched features for the purpose of partly isolating at least one region from the rest of the fixed substrate, this region having a portion of the fixed substrate that includes at least one anchoring foot, and the fixed substrate is mounted on the support substrate via fastening means applied outside the region.

Abstract: The invention relates to a gyrometer based on a vibrating structure, produced by micromachining in a thin planar wafer. It comprises four moving assemblies placed at the vertices of a virtual rectangle, each moving assembly being coupled to two moving assemblies located at neighboring vertices via a coupling structure and comprising an inertial first moving element connected to the coupling structure and intended to vibrate in two orthogonal directions in the plane of the wafer, namely an excitation direction and a detection direction, and a second moving element intended to vibrate in the detection direction and connected, on one side, to the first moving element and, on the other side, to anchoring zones via linking means.

Abstract: The invention relates to gyroscopes having a vibrating structure that is micromachined in a silicon substrate. A novel vibrating structure is described, which has two moving masses 14 and 14′, connected by a vibration energy coupling structure (transverse arms 26, 26′, longitudinal arms 22, 22′, and a short transverse link 24 between the longitudinal links 22, 22′). The moving masses are also suspended from U-shaped flexure arms (13), having one branch end connected to the mass and another end connected to a fixed anchoring point 18. The flexure arms are not inserted between the coupling structure and the mass, but are independent of the coupling structure. The masses are excited so as to vibrate in their plane by electrostatic forces applied by interdigitated combs 11. The Coriolis forces make them vibrate perpendicular to the plane, and this vibration is detected by electrodes forming part of the moving masses.