Abstract: A component carrier having a stack with i) at least one electrically conductive layer structure and at least one electrically insulating layer structure; and ii) a cavity provided in the stack. The cavity includes a) a first cavity portion provided on a first vertical level of the stack, wherein the first cavity portion partially vertically extends along the thickness of a first electrically insulating layer structure of the at least one electrically insulating layer structure, and b) a second cavity portion provided on a second vertical level of the stack, wherein the first cavity portion and the second cavity portion are connected to each other through their vertical thickness extension in the stack.

Abstract: A metal structure for a component carrier includes a first metal layer structure having a first recess exposed to a first surface and defining a first external boundary profile; and a second metal layer structure having a second recess exposed to a second surface and defining a second external boundary profile. The first metal layer structure and the second metal layer structure are stacked to face each other, so that the first recess and the second recess define a common recess, and the first external boundary profile of the first recess and the second external boundary profile of the second recess are misaligned in the stacking direction of the metal structure.

Abstract: An antenna assembly includes a stack and an antenna structure. The stack includes at least one electrically conductive layer structure and at least one electrically insulating layer structure, and a component, at least partially embedded in the stack. At least a portion of the electrically conductive layer structure is provided at the external side of the stack and is configured to act at least as part of an electromagnetic wave coupling structure. The component is coupled to the electromagnetic wave coupling structure. The antenna structure provides an opening to a channel. The stack and the antenna structure are connected so that the electromagnetic wave coupling structure and the opening to the channel face each other.

Abstract: A component carrier which comprises a stack comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and a photosensitive adhesion promoter on or above the stack, wherein only a sub-portion of the photosensitive adhesion promoter is photoactivated, and electrically conductive material selectively on said sub-portion of the photosensitive adhesion promoter.