Patents by Inventor Claudia Goltl

Claudia Goltl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for subdividing wafers into chips
    Patent number: 6833284
    Abstract: In order to subdivide a wafer (1) into chips, recesses (7) are introduced from a rear side (6), said recesses weakening the wafer (1) at the breaking points. As a result, it is possible to produce chips whose length dimensions are less than twice the thickness of the chips.
    Type: Grant
    Filed: January 20, 2004
    Date of Patent: December 21, 2004
    Assignee: Osram Opto Semiconductors GmbH
    Inventors: Claudia Göltl, Frank Kuhn
  • Method for subdividing wafers into chips
    Publication number: 20040161907
    Abstract: In order to subdivide a wafer (1) into chips, recesses (7) are introduced from a rear side (6), said recesses weakening the wafer (1) at the breaking points. As a result, it is possible to produce chips whose length dimensions are less than twice the thickness of the chips.
    Type: Application
    Filed: January 20, 2004
    Publication date: August 19, 2004
    Inventors: Claudia Goltl, Frank Kuhn