Abstract: A lead-frame for electronic devices is proposed; the lead-frame is produced from a metal plate and includes a bearing structure arranged in a first plane, and for each electronic device a support element spaced apart from the first plane having a first surface facing the bearing structure for mounting at least one chip and an opposed second surface for being exposed from the electronic device, the second surface being arranged in a second plane, and a plurality of interconnection elements connecting the support element to the bearing structure. For each electronic device the lead-frame further includes an intermediate area between the support element and the interconnection elements, the intermediate area being arranged in a third plane between the first and the second planes.

Abstract: A planar metallic foil is formed defining a lie plane which includes a supporting frame for a mount pad and corresponding leads being short-circuited to the mount pad. The mount pad is then down-set on a plane being parallel to the lie plane so as to keep at least a group of leads on the lie plane and separate by shearing the mount plane from the group of leads. A die is then mounted on a first surface of the mount pad. Electrical connections are then formed between the die and the group of leads. The frame is then encapsulated in a protective package so as to leave a second surface of the mount pad, being opposite to the first surface, exposed from the protective package.