Patents by Inventor Claudio Di Leo

Claudio Di Leo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10292291
    Abstract: An electronic device such as a media player is formed from electrical components such as integrated circuits, buttons, and a battery. Electrical input-output port contacts are used to play audio and to convey digital signals. Electrical components for the device are mounted to a substrate. The components are encapsulated in an encapsulant and covered with an optional housing structure. The electrical input-output port contacts and portions of components such as buttons remain uncovered by encapsulant during the encapsulation process. Integrated circuits are entirely encapsulated with encapsulant. The integrated circuits are packaged or unpackaged integrated circuit die. The substrate is a printed circuit board or is an integrated circuit to which components are directly connected without any printed circuit boards interposed between the integrated circuit and the components.
    Type: Grant
    Filed: March 27, 2018
    Date of Patent: May 14, 2019
    Assignee: Apple Inc.
    Inventors: Christopher D. Prest, Claudio Di Leo
  • Publication number: 20180220542
    Abstract: An electronic device such as a media player is formed from electrical components such as integrated circuits, buttons, and a battery. Electrical input-output port contacts are used to play audio and to convey digital signals. Electrical components for the device are mounted to a substrate. The components are encapsulated in an encapsulant and covered with an optional housing structure. The electrical input-output port contacts and portions of components such as buttons remain uncovered by encapsulant during the encapsulation process. Integrated circuits are entirely encapsulated with encapsulant. The integrated circuits are packaged or unpackaged integrated circuit die. The substrate is a printed circuit board or is an integrated circuit to which components are directly connected without any printed circuit boards interposed between the integrated circuit and the components.
    Type: Application
    Filed: March 27, 2018
    Publication date: August 2, 2018
    Inventors: Christopher D. Prest, Claudio Di Leo
  • Patent number: 8724339
    Abstract: An electronic device such as a media player is formed from electrical components such as integrated circuits, buttons, and a battery. Electrical input-output port contacts are used to play audio and to convey digital signals. Electrical components for the device are mounted to a substrate. The components are encapsulated in an encapsulant and covered with an optional housing structure. The electrical input-output port contacts and portions of components such as buttons remain uncovered by encapsulant during the encapsulation process. Integrated circuits are entirely encapsulated with encapsulant. The integrated circuits are packaged or unpackaged integrated circuit die. The substrate is a printed circuit board or is an integrated circuit to which components are directly connected without any printed circuit boards interposed between the integrated circuit and the components.
    Type: Grant
    Filed: December 1, 2009
    Date of Patent: May 13, 2014
    Assignee: Apple Inc.
    Inventors: Christopher D. Prest, Claudio Di Leo
  • Patent number: 8314354
    Abstract: Accessories such as headsets for electronic devices are provided. A headset may be provided with a button controller assembly that has user-actuated buttons and a microphone. The microphone may be formed by mounting a microphone transducer on a printed circuit board. A housing may be mounted over the transducer to form a sealed cavity for the transducer. Circuitry may be mounted on portions of the printed circuit board that extend beyond the edges of the microphone housing. The button controller assembly may have dome switches. The dome switches may have a housing that encloses dome switch components and that forms a structural internal part for the button controller. The dome switch housing structure may have tabs or other engagement features that mate with corresponding engagement features in a button member. The button member may be pressed by a user to actuate a desired dome switch.
    Type: Grant
    Filed: February 9, 2010
    Date of Patent: November 20, 2012
    Assignee: Apple Inc.
    Inventors: Christopher D. Prest, Claudio Di Leo, Jahan Minoo
  • Publication number: 20110194710
    Abstract: Accessories such as headsets for electronic devices are provided. A headset may be provided with a button controller assembly that has user-actuated buttons and a microphone. The microphone may be formed by mounting a microphone transducer on a printed circuit board. A housing may be mounted over the transducer to form a sealed cavity for the transducer. Circuitry may be mounted on portions of the printed circuit board that extend beyond the edges of the microphone housing. The button controller assembly may have dome switches. The dome switches may have a housing that encloses dome switch components and that forms a structural internal part for the button controller. The dome switch housing structure may have tabs or other engagement features that mate with corresponding engagement features in a button member. The button member may be pressed by a user to actuate a desired dome switch.
    Type: Application
    Filed: February 9, 2010
    Publication date: August 11, 2011
    Inventors: Christopher D. Prest, Claudio Di Leo, Jahan Minoo
  • Publication number: 20110128712
    Abstract: An electronic device such as a media player may be formed from electrical components such as integrated circuits, buttons, and a battery. Electrical input-output port contacts may be used to play audio and to convey digital signals. Electrical components for the device may be mounted to a substrate. The components may be encapsulated in an encapsulant and covered with an optional housing structure. The electrical input-output port contacts and portions of components such as buttons may remain uncovered by encapsulant during the encapsulation process. Integrated circuits may be entirely encapsulated with encapsulant. The integrated circuits may be packaged or unpackaged integrated circuit die. The substrate may be a printed circuit board or may be an integrated circuit to which components are directly connected without interposed printed circuit board materials.
    Type: Application
    Filed: December 1, 2009
    Publication date: June 2, 2011
    Inventors: Christopher D. Prest, Claudio Di Leo