Patents by Inventor Claudio Maria Villa

Claudio Maria Villa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Card assembly of power device in plastic package with external heat sink soldered to the internal heat sink
    Patent number: 6195256
    Abstract: An external heat sink is soldered to an internal heat sink incorporated into the bottom of a molded body of encapsulating resin for a package of an integrated power device. The power device is for surface mounting on a printed circuit board. The internal heat sink has at least a portion protruding from an outer surface of at least one face of the molded body. An external heat sink is mounted on the printed circuit board. The external heat sink has at least a surface abutting with a surface of the body, thus defining a separation gap between at least a surface of the protruding portion of the internal heat sink and an opposing surface of the external heat sink. This separation gap is filled with molten solder alloy during a normal soldering treatment of the printed circuit board.
    Type: Grant
    Filed: December 15, 1998
    Date of Patent: February 27, 2001
    Assignee: STMicroelectronics S.r.L.
    Inventors: Roberto Tiziani, Roberto Rossi, Claudio Maria Villa