Patents by Inventor Claudio Tagliapietra

Claudio Tagliapietra has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • QUAD FLAT NO-LEAD PACKAGE
    Publication number: 20190131197
    Abstract: An electronic circuit can include a semiconductor chip having a thickness smaller than 160 ?m and a package with flush contacts having the chip encapsulated therein. In some cases, the chip takes up more than twenty-five percent of the surface area of the package. The package can be a quad flat no-lead (QFN) package.
    Type: Application
    Filed: October 24, 2018
    Publication date: May 2, 2019
    Inventors: Felice Versiglia, Antoine Pavlin, Claudio Tagliapietra