Abstract: A solar cell is provided herein. The solar cell includes a substantially transparent substrate, a substantially thin and transparent nickel-based conformal layer deposited on the substrate surface, and at least one interconnect formed on the conformal layer to facilitate energy conversion of the solar cell. The conformal layer can be made from a nickel-based material and is designed to enhance ohmic contact to the interconnect. The conformal layer can also act to facilitate the conversion of light energy into electrical current by the interconnect, while minimizing energy loss, such that the overall conversion efficiency of the solar cell can be improved. The conformal layer can further facilitate transmission of electrical current along the solar cell. A method for manufacturing a solar cell is also provided.

Abstract: A photovoltaic cell is provided herein. The photovoltaic cell includes a substrate whereby at least one interconnects may be formed over the substrate to facilitate energy conversion of the photovoltaic cell. In this embodiment, a conformal layer may be deposited over the interconnects, the conformal layer having a thickness of up to about 100 nm, and whereby the conformal layer is designed to permit external radiation to pass through to the interconnects so as to enhance the efficiency of energy conversion by at least about 25% as measured at standard test condition. In another embodiment, the interconnects of the photovoltaic cell may have tapered profile as to facilitate collection of diffused external radiation. In some instances, the tapered profile may facilitate in diverting the diffused external radiation to the interconnects for enhancing energy conversion of the photovoltaic cell. A method for method of manufacturing a photovoltaic cell is also provided.

Abstract: The invention provides an optoelectronic assembly for coupling an optical conductor to a light emitting surface of an optoelectronic semiconductor device on a substrate. The optoelectronic assembly includes a multilayer having a cavity adapted to receive and electrically connect the optoelectronic semiconductor device to the multilayer substrate and a groove leading to the cavity and being adapted to receive and optically connect the optical conductor to the light emitting surface of said optoelectronic semiconductor device. The optoelectronic semiconductor device and the optical conductor are precisely positioned within the cavity and the groove, respectively, so that light emitted from the light emitting surface of the optoelectronic semiconductor device couples to an optical surface of the optical conductor.

Abstract: The invention provides an optoelectronic assembly for coupling an optical conductor to a light emitting surface of an optoelectronic semiconductor device on a substrate. The optoelectronic assembly includes a multilayer having a cavity adapted to receive and electrically connect the optoelectronic semiconductor device to the multilayer substrate and a groove leading to the cavity and being adapted to receive and optically connect the optical conductor to the light emitting surface of said optoelectronic semiconductor device. The optoelectronic semiconductor device and the optical conductor are precisely positioned within the cavity and the groove, respectively, so that light emitted from the light emitting surface of the optoelectronic semiconductor device couples to an optical surface of the optical conductor.