Patents by Inventor Claudis Feger

Claudis Feger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050127500
    Abstract: In an integrated circuit packaging structure, such as in an MCM or in a SCM, a compliant thermally conductive material is applied between a heat-generating integrated circuit chip and a substrate attached thereto. Raised regions are defined on the back side of the chip aligned to areas of a higher than average power density on the front active surface of the chip such that a thinner layer of the compliant thermally conductive material is disposed between the chip and the substrate in this area after assembly thereof resulting in a reduced “hot-spot” temperature on the chip. In an exemplary embodiment, the substrate includes one of a heat sink, cooling plate, thermal spreader, heat pipe, thermal hat, package lid, or other cooling member.
    Type: Application
    Filed: December 10, 2003
    Publication date: June 16, 2005
    Applicant: International Business Machines Corporation
    Inventors: Evan Colgan, Claudis Feger, Gary Goth, George Katopis, John Magerlein, Edmund Sprogis