Patents by Inventor Claudius Ferger

Claudius Ferger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • No flow underfill or wafer level underfill and solder columns
    Patent number: 9343423
    Abstract: A preassembly semiconductor device comprises chip soldering structures on a semiconductor chip and substrate soldering structures on a substrate corresponding to the chip soldering structures. The substrate soldering structures extend toward the chip soldering structures for forming solder connections with the chip soldering structures. The chip and the substrate are in preassembly positions relative to one another. The height of the substrate soldering structures is greater than the height of the chip soldering structures. A pre-applied underfill is contiguous with the substrate and is sufficiently thick so as to extend substantially no further than the full height of the substrate soldering structures.
    Type: Grant
    Filed: October 28, 2014
    Date of Patent: May 17, 2016
    Assignee: International Business Machines Corporation
    Inventors: Claudius Ferger, Michael A. Gaynes, Jae-Woong Nah, Da-Yuan Shih
  • No flow underfill or wafer level underfill and solder columns
    Patent number: 9305896
    Abstract: A preassembly semiconductor device comprises chip soldering structures on a semiconductor chip and substrate soldering structures on a substrate corresponding to the chip soldering structures. The substrate soldering structures extend toward the chip soldering structures for forming solder connections with the chip soldering structures. The chip and the substrate are in preassembly positions relative to one another. The height of the substrate soldering structures is greater than the height of the chip soldering structures. A pre-applied underfill is contiguous with the substrate and is sufficiently thick so as to extend substantially no further than the full height of the substrate soldering structures.
    Type: Grant
    Filed: October 27, 2014
    Date of Patent: April 5, 2016
    Assignee: International Business Machines Corporation
    Inventors: Claudius Ferger, Michael A. Gaynes, Jae-Woong Nah, Da-Yuan Shih