Abstract: A transparent pad having a polishing surface with an average surface roughness of 5 ?m or less is used as a polishing pad. An indentation is formed on the back surface of the transparent pad such that its rate of light transmission is locally changed. The transparent pad has a rate of light transmission equal to or greater than 10% or preferably 30% for light of at least one wavelength in the range of 350 nm–900 nm.

Abstract: A device and method for laminating CMP pads includes supporting the CMP pad with a board having material compositions similar to the CMP pad. By thus supporting the CMP pad during lamination, there is less likelihood of damage to the CMP pad and better adhesion from lamination. In particular, the CMP pad materials are laminated while in contact with a first board that may have a recess to accept the CMP pad. The pad has dimensions that are equal to or greater than the pad material. In an alternative embodiment, a board is provided on the opposite side of the CMP pad for lamination.

Abstract: A device and method for laminating CMP pads includes supporting the CMP pad with a board having material compositions similar to the CMP pad. By thus supporting the CMP pad during lamination, there is less likelihood of damage to the CMP pad and better adhesion from lamination. In particular, the CMP pad materials are laminated while in contact with a first board that may have a recess to accept the CMP pad. The pad has dimensions that are equal to or greater than the pad material. In an alternative embodiment, a board is provided on the opposite side of the CMP pad for lamination.

Abstract: A transparent pad having a polishing surface with an average surface roughness of 5 ?m or less is used as a polishing pad. An indentation is formed on the back surface of the transparent pad such that its rate of light transmission is locally changed. The transparent pad has a rate of light transmission equal to or greater than 10% or preferably 30% for light of at least one wavelength in the range of 350 nm-900 nm.

Abstract: A polishing pad is formed with a non-foamed member shaped as a plate having a flat surface and abrading particles affixed inside and on the surfaces of this non-foamed member. Its average surface roughness is in the range of 0.5 ?m-10 ?m, and its Shore D hardness is within the range of 50-85. Grooves are formed on the surface of the polishing pad for collecting debris generated during the polishing operation and serving also as flow routes of a polishing liquid for distributing it uniformly over the surface of the polishing pad.