Patents by Inventor Claus Dusemund

Claus Dusemund has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Monitoring apparatus and method for in-situ measurement of wafer thicknesses for monitoring the thinning of semiconductor wafers and thinning apparatus comprising a wet etching apparatus and a monitoring apparatus
    Patent number: 8716039
    Abstract: According to the invention, a monitoring device (12) is created for monitoring a thinning of at least one semiconductor wafer (4) in a wet etching unit (5), wherein the monitoring device (12) comprises a light source (14), which is designed to emit coherent light of a light wave band for which the semiconductor wafer (4) is optically transparent. The monitoring device (12) further comprises a measuring head (13), which is arranged contact-free with respect to a surface of the semiconductor wafer (4) to be etched, wherein the measuring head (13) is designed to irradiate the semiconductor wafer (4) with the coherent light of the light wave band and to receive radiation (16) reflected by the semiconductor wafer (4). Moreover, the monitoring device (12) comprises a spectrometer (17) and a beam splitter, via which the coherent light of the light wave band is directed to the measuring head (13) and the reflected radiation is directed to the spectrometer (17).
    Type: Grant
    Filed: January 10, 2011
    Date of Patent: May 6, 2014
    Assignee: Precitec Optronik GmbH
    Inventors: Claus Dusemund, Martin Schoenleber, Berthold Michelt, Christoph Dietz
  • MONITORING APPARATUS AND METHOD FOR IN-SITU MEASUREMENT OF WAFER THICKNESSES FOR MONITORING THE THINNING OF SEMICONDUCTOR WAFERS AND THINNING APPARATUS COMPRISING A WET ETCHING APPARATUS AND A MONITORING APPARATUS
    Publication number: 20130034918
    Abstract: According to the invention, a monitoring device (12) is created for monitoring a thinning of at least one semiconductor wafer (4) in a wet etching unit (5), wherein the monitoring device (12) comprises a light source (14), which is designed to emit coherent light of a light wave band for which the semiconductor wafer (4) is optically transparent. The monitoring device (12) further comprises a measuring head (13), which is arranged contact-free with respect to a surface of the semiconductor wafer (4) to be etched, wherein the measuring head (13) is designed to irradiate the semiconductor wafer (4) with the coherent light of the light wave band and to receive radiation (16) reflected by the semiconductor wafer (4). Moreover, the monitoring device (12) comprises a spectrometer (17) and a beam splitter, via which the coherent light of the light wave band is directed to the measuring head (13) and the reflected radiation is directed to the spectrometer (17).
    Type: Application
    Filed: January 10, 2011
    Publication date: February 7, 2013
    Applicants: DUSEMUND PTE. LTD, PRECITEC OPTRONIC GMBH
    Inventors: Claus Dusemund, Martin Schoenleber, Berthold Michelt, Christoph Dietz
  • Method for the purification of hydrogen peroxide solutions
    Patent number: 6939527
    Abstract: The invention relates to a novel chromatographic process for the further purification of hydrogen peroxide solutions, giving high-purity solutions which can be employed in semiconductor technology under today's high purity requirements.
    Type: Grant
    Filed: March 29, 2001
    Date of Patent: September 6, 2005
    Assignee: Merck Patent GmbH
    Inventors: Dietmar Oeter, Claus Dusemund, Ewald Neumann, Klaus Freissler, Martin Hostalek
  • Supply system for chemicals and its use
    Patent number: 6679764
    Abstract: The present invention relates to a novel supply system for chemicals which permits the preparation of solid-containing suspensions, which are required, inter alia, for polishing wafers or in semiconductor production, directly at the point of use.
    Type: Grant
    Filed: February 27, 2001
    Date of Patent: January 20, 2004
    Assignee: Merck Patent GmbH
    Inventors: Ulrich Finkenzeller, Claus Dusemund, Thomas Schwortschik
  • System for conveying liquids without pulsing
    Patent number: 6623248
    Abstract: A system tot the pulsation-free delivery of liquids, which system may be used for high-purity, liquid chemicals in the semiconductor industry.
    Type: Grant
    Filed: June 8, 2001
    Date of Patent: September 23, 2003
    Assignee: Merck Patent GmbH
    Inventors: Claus Dusemund, Klaus Freissler, Wilfried Jammer, Michael Poth, Alberto Dix, Eberhard Tempel
  • Method for the purification of hydrogen peroxide solutions
    Publication number: 20030165420
    Abstract: The invention relates to a novel chromatographic process for the further purification of hydrogen peroxide solutions, giving high-purity solutions which can be employed in semiconductor technology under today's high purity requirements.
    Type: Application
    Filed: November 22, 2002
    Publication date: September 4, 2003
    Inventors: Dietmar Oeter, Claus Dusemund, Ewald Neumann, Klaus Freissler, Martin Hostalek
  • Buffer solutions for suspensions used in chemical-mechanical polishing
    Patent number: 6338743
    Abstract: The present invention relates to buffer systems in the form of solutions or salts for preparing suspensions which can be used for chemomechanical polishing. In particular, these buffer systems can be used for preparing suspensions having a high pH of 9.5-13 which are used for the chemomechanical polishing of Si and metal surfaces of semiconductors, known as wafers.
    Type: Grant
    Filed: April 3, 2000
    Date of Patent: January 15, 2002
    Assignee: Merck Patent Gesellschaft mit beschrankter Haftung
    Inventors: Claus Dusemund, Rudolf Rhein, Manuela Schweikert, Martin Hostalek
  • Supply system for chemicals and its use
    Publication number: 20010006882
    Abstract: The present invention relates to a novel supply system for chemicals which permits the preparation of solid-containing suspensions, which are required, inter alia, for polishing wafers or in semiconductor production, directly at the point of use.
    Type: Application
    Filed: February 27, 2001
    Publication date: July 5, 2001
    Applicant: Merck Patent Gesellschaft mit Beschrankter Haftung
    Inventors: Ulrich Finkenzeller, Claus Dusemund