Abstract: A semiconductor die with backside protection includes an active region and a first polysilicon layer formed on a front side of a semiconductor substrate. A signal net is connected to the first polysilicon layer by way of a metal contact and a conductive wire is formed above the active region. During an invasive attack, when a trench is formed in the substrate and an electrically conductive filling is deposited in the trench, the signal net, the conductive wire, and the first polysilicon shape form a short-circuit, which renders the die dysfunctional and thereby foiling the invasive attack.

Abstract: Aspects of the present disclosure are directed toward methods and systems which generate a plurality of Read-Only Memory (ROM) codes. In response to generating the ROM codes, an image is generated for each of the plurality of ROM codes. The images for each of the plurality of ROM codes are mapped on a single reticle, and a wafer is provided, which includes a plurality of individual devices. The reticle is utilized, which includes an image for each of the plurality of ROM codes, to print a respective one of the images onto a respective one of the plurality of individual devices.