Abstract: A device and a method for cooling one or several high-performance computers or circuits located in one or more housings and including a dual-circuit cooling system. The high-performance computers or circuits are dipped into a dielectric first cooling liquid in a cuboid basin with a completely fluid-tight configuration and a first cooling circuit with a pump is arranged in the basin for the circulation of the first cooling liquid, with the first cooling liquid being forced to flow through the housings of the high-performance computers or circuits during circulation, thus cooling them. In the basin, a heat exchanger, a forward flow and a return flow of a second cooling circuit with the second cooling liquid are accommodated, and the heat exchanger is dipped into the first cooling liquid and the first liquid is cooled by a second cooling liquid.

Abstract: The invention relates to a device for introducing biomaterial into a pressure-loaded combustion or carburetor chamber (1), comprising a feed apparatus (2) for feeding biomaterial to a pressure pipe (3), in which a plunger (4) is guided in such a way that the plunger can be moved back and forth against a pressure lock (5) to the combustion or carburetor chamber (1) in order to form a compressed plug (6) comprised of biomaterial, which is sealed against the combustion chamber (1) and which is periodically advanced toward the combustion chamber (1).