Abstract: A method for grinding the surface of non-round workpieces. The method includes the steps of clamping a workpiece within a machining unit; machining the workpiece; without unclamping the workpiece, contactlessly measuring the workpiece using an optical measuring device having a conoscopic holography sensor with a characteristic measuring range; and machining and measuring the workpiece in an alternating manner to iteratively approach the desired measurements of a specified form by adjusting the distance between the optical measuring device and the surface of the workpiece depending on there being a deviation of the surface from the specified form so that a respectively measured area of the surface of the workpiece remains within the measuring range of the optical sensor.

Abstract: An apparatus and method for machining workpieces is provided, in particular, for grinding the surface of non-round workpieces. The workpiece is clamped within a machining unit and the surface of this workpiece is contactlessly measured by means of a measuring device while the workpiece is clamped within the machine.

Abstract: A measuring head system for a coordinate measuring machine, having a scanning element for contacting a measured object as a contacting part, which can be moved such that an object to be measured can be mechanically scanned using the scanning element. An optical sensor is fixed on the measuring head base. Means are provided to generate a projection on the sensor line using at least one radiation source. The means have at least one first mask element to generate a first partial projection on the sensor line such that said partial projection is optimized to determine an x displacement and a y displacement of the contacting part in relation to the measuring head base in the x direction or y direction. An analysis unit is configured to determine the x displacement and the y displacement from signals only generated by the one sensor line.

Abstract: The invention relates to a measuring head system (1) for a coordinate measuring machine, having a scanning element (6), which has a part provided for contacting a measured object as a contacting part (5), which can be moved in relation to a fixed measuring head base (2) in a lateral x direction (20) and a lateral y direction (21), such that an object to be measured can be mechanically scanned using the scanning element (6). An optical sensor (10), having a sensor line (11) which can be read out and comprises a plurality of array sensor elements, is fixed on the measuring head base (2). Furthermore, means are provided, which are particularly disposed spatially fixed to the contacting part (5), generate a projection—as a function of displacements of the contacting part (5) in relation to the measuring head base (2)—on the sensor line (11) using at least one radiation source (15). In addition, an analysis unit is provided.