Abstract: In embodiments herein, circuit components are embedded within a core layer of a substrate. The circuit components are vertically oriented within a cavity or hole of the core layer of the substrate, e.g., with conductive contacts on an edge of the component that is substantially orthogonal to a plane of the core layer. The edge that is substantially orthogonal to a plane of the core layer may be the longest edge of the component.

Abstract: Technologies for components embedded in a substrate core are disclosed. In one embodiment, power components such as deep trench capacitors are disposed in a cavity defined in a substrate core for a circuit board of an integrated circuit package, such as a processor. A spacer may be included between the power components. The power components are stacked on top of each other, allowing for the stack of power components to match the height of the substrate core, even when the height of the individual power components is less than the height of the substrate core. Configuring the power components in this manner can provide mechanical stability to the power components and substrate core and provide power to a semiconductor die mounted on the circuit board.

Abstract: Technologies for connected components embedded in a substrate core are disclosed. In one embodiment, power components such as deep trench capacitors are disposed in a cavity defined in a substrate core for a circuit board of an integrated circuit package, such as a processor. The power components are stacked on top of each other, allowing for the stack of power components to match the height of the substrate core, even when the height of the individual power components is less than the height of the substrate core. Through-silicon vias in some or all of the power components can allow for connections through one power component to another. Configuring the power components in this manner can provide mechanical stability to the power components and substrate core and provide power to a semiconductor die mounted on the circuit board.

Abstract: Systems, apparatus, articles of manufacture, and methods to embed semiconductor devices in cores of package substrates are disclosed. An example package substrate includes a core having a first surface and a second surface. The core includes a cavity extending between the first and second surfaces. The example package substrate further includes a semiconductor die within the cavity; a pedestal within the cavity; and an adhesive within the cavity. The adhesive surrounds the semiconductor die and the pedestal. A material of the pedestal different from a material of the adhesive.

Abstract: A polyimide, comprising 1-100 mol % of repeating units of formula (1), based on 100 mol % of total repeating units of the polyimide, wherein each V is as defined herein; and each R1 is independently a divalent group of formula (3), wherein A is anionic, and each A is independently —O, —S, —S(O)2, —S(O)2O, —OS(O)2O, —OP(O) (OR)dO, —P(O)(Re)O, —P(O)(ORf)O, or —OP(O)(Rg)O; and X is cationic, and each X is independently Li, Na, K, Cs, Mg, Ca, Sr, Cr, Mn, Fe, Co, Ni, Cu, Ag, Zn, Cd, B, Al, Ga, In, Ge, Sn, Pb, As, Sb, phosphonium, imidazolium, guanidinium, or pyridinium; and Rd, Re, Rf, and Rg are each independently hydrogen, substituted or unsubstituted C1-8 alkyl, or substituted or unsubstituted C6-12 aryl.

Abstract: Exemplary seal cleaning apparatuses may include at least one support that is configured to receive a seal. The apparatuses may include a tool arm that is positionable within an interior of the seal. The apparatuses may include a pad holder that is rotatably coupled with the tool arm. The pad holder may include a body having a first end and a second end. The first end may define a channel that is configured to receive a cleaning pad. The body may define an aperture that extends from the second end through the channel. The pad holder may include a fluid fitting coupled with the aperture at the second end of the body. The apparatuses may include a cleaning fluid source that is fluidly coupled with the fluid fitting.

Abstract: A self-branching polyetherimide comprising a first repeating unit derived from polymerization of the aromatic dianhydride and a first diamine, wherein the first diamine comprises a carboxyl-substituted C6-24 aromatic hydrocarbon group; and optionally, a second repeating unit derived from polymerization of an aromatic dianhydride and a second diamine, wherein the second diamine comprises a C1-30 divalent hydrocarbon group, optionally comprising 1 to 4 heteroatoms, wherein the self-branching polyetherimide is end-capped with phthalic anhydride.

Abstract: Method and systems for cleaning and wetting a semiconductor substrate, are provided. Methods and systems include forming an atmosphere in a basin housing the semiconductor substrate with a gas having a higher solubility in a wetting agent than oxygen. Methods and systems include spraying the wetting agent with a spray head onto the substrate while maintaining the atmosphere. Methods and systems include rotationally translating the semiconductor substrate, the spray head, or both the semiconductor substrate and the spray head, Methods and systems include wetting a plurality of features defined in the substrate.

Abstract: The present invention relates to poly(amide imide) (PAI) precursor polymers which can for example be used in Vat photopolymerization processes like lithographic processes for the photofabrication of three-dimensional (3D) articles. The invention further relates to polymer compositions including these poly(amide imide) (PAI) precursor polymers. Still further, the invention relates to vat photopolymerization methods to form three-dimensional (3D) objects that incorporate the aforementioned polymer compositions.

Abstract: Nystagmus conditions of a subject can be valuated by taking an image of at least a portion of the eye of the subject. The image is then converted into data related to relative lightness or darkness of portions of the image. Next the data is compared to at least baseline data if not data from multiple images of the subject to be able to report a physical condition of the subject, such as a blood alcohol level based on horizontal nystagmus conditions.