Abstract: A test socket and system for testing packaged electronic circuits. The test system includes a control unit coupled by a communication channel to a socket which provides a location for mounting and testing a packaged electronic circuit. The socket includes one or more designated pairs of electrical connectors that provide power to the packaged electronic circuit. Each of the one or more designated pairs of electrical connectors includes a first electrical connector and a second electrical connector. In one embodiment, the first electrical connector and the second electrical connector in one or more pairs of designated connectors are connected together by a capacitor. In another embodiment, one or more capacitors that connect together the first electrical connector and the second electrical connector in one or more designated pairs of electrical connectors are packaged and embedded in the body of the socket.

Abstract: A test socket and system for testing packaged electronic circuits. The test system includes a control unit coupled by a communication channel to a socket which provides a location for mounting and testing a packaged electronic circuit. The socket includes one or more designated pairs of electrical connectors that provide power to the packaged electronic circuit. Each of the one or more designated pairs of electrical connectors includes a first electrical connector and a second electrical connector. In one embodiment, the first electrical connector and the second electrical connector in one or more pairs of designated connectors are connected together by a capacitor. In another embodiment, one or more capacitors that connect together the first electrical connector and the second electrical connector in one or more designated pairs of electrical connectors are packaged and embedded in the body of the socket.

Abstract: A test socket and system for testing packaged electronic circuits. The test system includes a control unit coupled by a communication channel to a socket which provides a location for mounting and testing a packaged electronic circuit. The socket includes one or more designated pairs of electrical connectors that provide power to the packaged electronic circuit. Each of the one or more designated pairs of electrical connectors includes a first electrical connector and a second electrical connector. In one embodiment, the first electrical connector and the second electrical connector in one or more pairs of designated connectors are connected together by a capacitor. In another embodiment, one or more capacitors that connect together the first electrical connector and the second electrical connector in one or more designated pairs of electrical connectors are packaged and embedded in the body of the socket.

Abstract: A test socket and system for testing packaged electronic circuits. The test system includes a control unit coupled by a communication channel to a socket which provides a location for mounting and testing a packaged electronic circuit. The socket includes one or more designated pairs of electrical connectors that provide power to the packaged electronic circuit. Each of the one or more designated pairs of electrical connectors includes a first electrical connector and a second electrical connector. In one embodiment, the first electrical connector and the second electrical connector in one or more pairs of designated connectors are connected together by a capacitor. In another embodiment, one or more capacitors that connect together the first electrical connector and the second electrical connector in one or more designated pairs of electrical connectors are packaged and embedded in the body of the socket.

Abstract: An ink jet printer (10) having a print head (14) for directing an ink jet toward a sheet of paper (16) includes automatic print head spacing apparatus (80) that holds the print head apart from the sheet of paper by a preselected distance. In a preferred embodiment, the printer includes a rotatable drum (20) for supporting the sheet of paper and media securing system (24) of a first predetermined thickness for securing the paper to the drum. The print head is positioned at the preselected distance after a major surface (130) of the print head engages and is pushed back by the media securing system.