Patents by Inventor Clemence DEMAREZ

Clemence DEMAREZ has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Radiation-activatable pressure-sensitive adhesive tape having a dark reaction and use thereof
    Patent number: 11384261
    Abstract: A pressure-sensitive adhesive tape comprising or consisting of a radiation-activatable polymerizable composition comprising or consisting of: A 5 to 60 parts by weight of at least one film former component; B 40 to 95 parts by weight of at least one epoxy component; C 0.1 to 10 parts by weight of at least one photoinitiator, and D optionally 0.1 to 200 parts by weight of at least one additive, based in each case on the radiation-activatable polymerizable composition, where the parts by weight of components A and B add up to 100, wherein the film former component A comprises or consists of at least one polyurethane polymer and method of joining two components with the pressure-sensitive adhesive tape.
    Type: Grant
    Filed: March 14, 2017
    Date of Patent: July 12, 2022
    Assignee: TESA SE
    Inventors: Clemence Demarez, Christian Schuh
  • RADIATION-ACTIVATABLE PRESSURE-SENSITIVE ADHESIVE TAPE HAVING A DARK REACTION AND USE THEREOF
    Publication number: 20190077997
    Abstract: A pressure-sensitive adhesive tape comprising or consisting of a radiation-activatable polymerizable composition comprising or consisting of: A 5 to 60 parts by weight of at least one film former component; B 40 to 95 parts by weight of at least one epoxy component; C 0.1 to 10 parts by weight of at least one photoinitiator, and D optionally 0.1 to 200 parts by weight of at least one additive, based in each case on the radiation-activatable polymerizable composition, where the parts by weight of components A and B add up to 100, wherein the film former component A comprises or consists of at least one polyurethane polymer and method of joining two components with the pressure-sensitive adhesive tape.
    Type: Application
    Filed: March 14, 2017
    Publication date: March 14, 2019
    Applicant: tesa SE
    Inventors: Clemence DEMAREZ, Christian SCHUH