Patents by Inventor Clemens GRUENSTEIDL

Clemens GRUENSTEIDL has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10401160
    Abstract: For a simple, fast, safe and reliable determination of the layer thickness of a bonding layer between two layers of a packaging, a laser ultrasonic method is provided, in which the transit time of the ultrasonic wave through the first and second packaging layers (2, 3) is determined in advance, and a maximum (M1, M2, Mn) in the measurement signal (S) is sought, and the point in time of occurrence of this maximum (M1, M2, Mn) is determined as the total transit time (T1, T2, Tn) of the ultrasonic wave, and the transit time of the ultrasonic wave through the first and second packaging layers (2, 3) is subtracted from the total transit time (T1, T2, Tn), and the thickness (d) of the bonding layer is deduced from the known ultrasonic speed (vS) in the bonding layer (5).
    Type: Grant
    Filed: March 12, 2014
    Date of Patent: September 3, 2019
    Assignees: CONSTANTIA TEICH GMBH, RESEARCH CENTER FOR NON DESTRUCTIVE TESTING GMBH
    Inventors: Bernhard Reitinger, Saeid Zamiri, Clemens Gruensteidl, Juergen Roither, Martin Kornfeld, Alfred Wegenberger
  • Publication number: 20160054122
    Abstract: For a simple, fast, safe and reliable determination of the layer thickness of a bonding layer between two layers of a packaging, a laser ultrasonic method is provided, in which the transit time of the ultrasonic wave through the first and second packaging layers (2, 3) is determined in advance, and a maximum (M1, M2, Mn) in the measurement signal (S) is sought, and the point in time of occurrence of this maximum (M1, M2, Mn) is determined as the total transit time (T1, T2, Tn) of the ultrasonic wave, and the transit time of the ultrasonic wave through the first and second packaging layers (2, 3) is subtracted from the total transit time (T1, T2, Tn), and the thickness (d) of the bonding layer is deduced from the known ultrasonic speed (vS) in the bonding layer (5).
    Type: Application
    Filed: March 12, 2014
    Publication date: February 25, 2016
    Applicants: CONSTANTIA TEICH GMBH, RESEARCH CENTER FOR NON DESTRUCTIVE TESTING GMBH
    Inventors: Bernhard REITINGER, Saeid ZAMIRI, Clemens GRUENSTEIDL, Juergen ROITHER, Martin KORNFELD, Alfred WEGENBERGER