Abstract: In the field of release and pickup of ultrathin semiconductor dies, there is provided an active carrier (1) for carrying a wafer (20) and a method for using such a carrier (1). The wafer (20) comprises a particular die arrangement (P). The active carrier (1) comprises a base plate (2) and a number of energizers (7) constructed on or in this base plate (2). The energizers (7) are laid out in an arrangement corresponding to the die arrangement (P). The energizers (7) can locally energize an adhesive layer (3) in proximity to a selected die (14) from the die arrangement (P). By this local energizing of the adhesive layer (P), the selected die is loosened from the adhesive layer (3). Furthermore the active carrier (1) comprises a plurality of externally addressable contacts (12) and conduction pathways (9). The conduction pathways (9) connect the contacts (12) to the energizers (7) thereby allowing individual control over said energizers (7) by addressing said contacts (12).

Abstract: There is provided a three-dimensional interconnect structure for micro-electronic devices and a method for producing such an interconnect structure. The method comprises a step wherein a backbone structure is manufactured using an additive layer-wise manufacturing process. The backbone structure comprises a three-dimensional cladding skeleton and a support structure. The cladding skeleton comprises layered freeform skeleton parts that will form the electric interconnections between the electric contacts of the interconnect structure after a conductive material is applied on the backbone structure. The support structure supports the layered freeform skeleton parts. Parts of the support structure may be removed to isolate and/or expose the electric interconnections. The cladding skeleton can be embedded by an insulating material for providing a further support.

Abstract: According to an aspect of the invention, there is provided a chip die manipulator apparatus arranged for pick and placing of a chip die (30) in a chip manufacturing process, comprising: a pickup head arranged to pick up the chip die with an active side facing the first pickup head (11); a second pickup head (21) arranged to perform a flip chip movement of the chip die (30), to have the active side facing away from the second pickup head (21), wherein the first pickup head (11) comprises a test card (12) comprising contact pads arranged to contact the active side of the chip die (30); and a clamp for clamping the chip die against the contact pads. Advantages may include reduction of the number of process steps and providing less breakdown risk in the manufacturing process due to in-place testing of chip dies.

Abstract: A pick-and-place machine, comprising: a pick station; a place station; a pick/place head for transporting a die from the pick station along a transport path to the place station; wherein the machine further comprises a die-face processing means, comprising an inspection unit and/or a cleaning unit, operable to process a face of the die on the transport path.