Abstract: An embodiment integrated circuit includes a first electromagnetic pulse detection device that comprises a first loop antenna formed in an interconnection structure of the integrated circuit, a first end of the first antenna being connected to a first node of application of a power supply potential and a second end of the antenna being coupled to a second node of application of the power supply potential, and a first circuit connected to the second end of the first antenna and configured to output a first signal representative of a comparison of a first current in the first antenna with a first threshold.

Abstract: An embodiment integrated circuit includes a first electromagnetic pulse detection device that comprises a first loop antenna formed in an interconnection structure of the integrated circuit, a first end of the first antenna being connected to a first node of application of a power supply potential and a second end of the antenna being coupled to a second node of application of the power supply potential, and a first circuit connected to the second end of the first antenna and configured to output a first signal representative of a comparison of a first current in the first antenna with a first threshold.

Abstract: A method of protecting a first chip in a multi-chip stack includes determining an electrical characteristic of a conductive loop. The conductive loop extends over a top portion of the first chip. The conductive loop also extends through the first chip and within a top portion of a second chip. The top portion of the second chip is adjacent to a bottom portion of the first chip. The method further includes determining whether the electrical characteristic indicates that an attack is being made to determine contents or operation of the first chip.

Abstract: A secure electronic chip including a plurality of biased semiconductor wells and a well biasing current detection circuit. Each of the wells includes a transistor and a bias contact electrically isolated from the transistor. The detection circuit is electrically coupled to each bias contact and is configured to detect a bias current passing through the bias contact that is indicative of an attempt to tamper with the electronic chip.

Abstract: An electronic chip includes a doped semiconductor substrate of a first conductivity type, a doped buried layer of a second conductivity type overlying the substrate, and a first doped well of the first conductivity type overlying the buried layer. Circuit components can be formed at a top surface of the first doped well and separated from the buried layer. A current detector is coupled to the buried layer and configured detect a bias current flowing into or out of the buried layer.

Abstract: A method of protecting a first chip in a multi-chip stack includes determining an electrical characteristic of a conductive loop. The conductive loop extends over a top portion of the first chip. The conductive loop also extends through the first chip and within a top portion of a second chip. The top portion of the second chip is adjacent to a bottom portion of the first chip. The method further includes determining whether the electrical characteristic indicates that an attack is being made to determine contents or operation of the first chip.

Abstract: A device includes a first chip having a front side and a back side. A second chip is stacked with the first chip and located on the back side of the first chip. A first loop includes first and second through vias located in the first chip. Each through via has a first end on the front side of the first chip and a second end on the back side of the first chip. The first loop also includes a first track that connects the first ends of the first and second through vias is located in the first chip on the front side thereof and a second track that connects the second ends of the first and second through vias is located in the second chip. A detection circuit can detect an electrical characteristic of the first loop.

Abstract: A laser detection device can be used to protect an integrated circuit. The device includes a detection cell having a buried channel of a first conductivity type extending in a substrate of the integrated circuit. The substrate is of a second conductivity type. The detection cell also has a first electrical connection coupling a first point in the buried channel to a supply voltage rail, and a second electrical connection coupled to a second point in the buried channel. A detection circuit is coupled to the second point in the buried channel via the second electrical connection and adapted to detect a fall in the voltage at the second point.

Abstract: An electronic chip includes a doped semiconductor substrate of a first conductivity type, a doped buried layer of a second conductivity type overlying the substrate, and a first doped well of the first conductivity type overlying the buried layer. Circuit components can be formed at a top surface of the first doped well and separated from the buried layer. A current detector is coupled to the buried layer and configured detect a bias current flowing into or out of the buried layer.

Abstract: An electronic chip includes a doped semiconductor substrate of a first conductivity type, a doped buried layer of a second conductivity type overlying the substrate, and a first doped well of the first conductivity type overlying the buried layer. Circuit components can be formed at a top surface of the first doped well and separated from the buried layer. A current detector is coupled to the buried layer and configured detect a bias current flowing into or out of the buried layer.

Abstract: A device includes a first chip having a front side and a back side. A second chip is stacked with the first chip and located on the back side of the first chip. A first loop includes first and second through vias located in the first chip. Each through via has a first end on the front side of the first chip and a second end on the back side of the first chip. The first loop also includes a first track that connects the first ends of the first and second through vias is located in the first chip on the front side thereof and a second track that connects the second ends of the first and second through vias is located in the second chip. A detection circuit can detect an electrical characteristic of the first loop.

Abstract: A laser detection device can be used to protect an integrated circuit. The device includes a detection cell having a buried channel of a first conductivity type extending in a substrate of the integrated circuit. The substrate is of a second conductivity type. The detection cell also has a first electrical connection coupling a first point in the buried channel to a supply voltage rail, and a second electrical connection coupled to a second point in the buried channel. A detection circuit is coupled to the second point in the buried channel via the second electrical connection and adapted to detect a fall in the voltage at the second point.

Abstract: An electronic chip includes a doped semiconductor substrate of a first conductivity type, a doped buried layer of a second conductivity type overlying the substrate, and a first doped well of the first conductivity type overlying the buried layer. Circuit components can be formed at a top surface of the first doped well and separated from the buried layer. A current detector is coupled to the buried layer and configured detect a bias current flowing into or out of the buried layer.

Abstract: A secure electronic chip including a plurality of biased semiconductor wells and a well biasing current detection circuit. Each of the wells includes a transistor and a bias contact electrically isolated from the transistor. The detection circuit is electrically coupled to each bias contact and is configured to detect a bias current passing through the bias contact that is indicative of an attempt to tamper with the electronic chip.