Abstract: A fixed abrasive three-dimensional plate includes micron size diamond beads or a mixture of abrasive particles and metal oxide beads, ranging in size from a few microns to a few tens of microns, incorporated into a matrix of one or more inorganic binders and fillers. The composition is formed into a rigid plate blank, and the abrasive plate is mounted on a substrate forming a lapping/polishing plate. The abrasive plate is capable of delivering high material removal rates coupled with reduced surface roughness when lapping/polishing advanced materials, including sapphire, titanium carbide reinforced alumina, silicon carbide, gallium nitride, aluminum nitride, zinc selenide, and other compound semiconductor materials, as well as, glass, ceramic, metallic, and composite workpieces. The diamond beads incorporated in the fixed abrasive three-dimensional plate include diamond particles ranging in size from a few nanometers to a few tens of microns, bonded with one or more inorganic binders and additives.

Abstract: A fixed abrasive three-dimensional plate includes micron size diamond beads or a mixture of abrasive particles and metal oxide beads, ranging in size from a few microns to a few tens of microns, incorporated into a matrix of one or more inorganic binders and fillers. The composition is formed into a rigid plate blank, and the abrasive plate is mounted on a substrate forming a lapping/polishing plate. The abrasive plate is capable of delivering high material removal rates coupled with reduced surface roughness when lapping/polishing advanced materials, including sapphire, titanium carbide reinforced alumina, silicon carbide, gallium nitride, aluminum nitride, zinc selenide, and other compound semiconductor materials, as well as, glass, ceramic, metallic, and composite workpieces. The diamond beads incorporated in the fixed abrasive three-dimensional plate include diamond particles ranging in size from a few nanometers to a few tens of microns, bonded with one or more inorganic binders and additives.

Abstract: The disclosure is generally related to a washable ink composition and a writing instrument containing the same. The disclosure provides a washable ink composition that includes a pigment capsule having a polymer matrix formed of a resin selected from the group consisting of aminoplast resins, epoxy resins, and combinations thereof, and at least one colorant contained in the polymer matrix; and at least one washing aid having at least 4 ethylene oxide units per molecule of washing aid and/or at least one washing aid having an HLB value of at least 12.

Abstract: The present invention provides a water-in-oil emulsion ink comprising an oil phase and a water phase, the oil phase comprising an encapsulated colorant, an oil phase oil, a surface active agent, and a film-forming component, and the water phase comprising water. The present invention also provides an encapsulated colorant comprising a colorant having a particle size of from about 0.01 microns to about 25 microns, a binder resin, a saturated oil, a viscosity adjusting agent, and an adhesion promoter. The present invention also provides an improved process of digital duplicating wherein the improvement comprises using the emulsion ink of the present invention.