Patents by Inventor Cliff C. Lee

Cliff C. Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9961769
    Abstract: The present disclosure relates to microelectronic substrates, such as interposers, motherboards, test platforms, and the like, that are fabricated to have overlapping connection zones, such that different microelectronic devices, such as microprocessors, chipsets, graphics processing devices, wireless devices, memory devices, application specific integrated circuits, and the like, may be alternately attached to the microelectronic substrates to form functional microelectronic packages.
    Type: Grant
    Filed: January 23, 2014
    Date of Patent: May 1, 2018
    Assignee: INTEL CORPORATION
    Inventors: Md Altaf Hossain, Cliff C. Lee, David W. Browning, Itai M. Pines, Brian P. Kelly
  • Publication number: 20180005972
    Abstract: Techniques and mechanisms for determining an accessibility of circuit functionality via interface structures of a microelectronic device. In an embodiment, a packaged microelectronic device includes a substrate having interconnect structures formed therein. The interconnect structures variously couple one or more integrated circuit (IC) dies of the packaged microelectronic device to respective conductors (or “contact lands”) at a side of the substrate. Access to some functionality of the one or more IC dies via certain ones the contact lands—the access during an operational mode of the packaged microelectronic device—may be selectively disabled based on testing which evaluates performance characteristics of the packaged microelectronic device. In another embodiment, some of the contact lands are covered with an insulator material to prevent deposition of solder on such contact lands.
    Type: Application
    Filed: July 1, 2016
    Publication date: January 4, 2018
    Inventors: Md Altaf HOSSAIN, Cliff C. LEE
  • Publication number: 20140133075
    Abstract: The present disclosure relates to microelectronic substrates, such as interposers, motherboards, test platforms, and the like, that are fabricated to have overlapping connection zones, such that different microelectronic devices, such as microprocessors, chipsets, graphics processing devices, wireless devices, memory devices, application specific integrated circuits, and the like, may be alternately attached to the microelectronic substrates to form functional microelectronic packages.
    Type: Application
    Filed: January 23, 2014
    Publication date: May 15, 2014
    Inventors: Md Altaf Hossain, Cliff C. Lee, David W. Browning, Itai M. Pines, Brian P. Kelly
  • Patent number: 8674235
    Abstract: The present disclosure relates to microelectronic substrates, such as interposers, motherboards, test platforms, and the like, that are fabricated to have overlapping connection zones, such that different microelectronic devices, such as microprocessors, chipsets, graphics processing devices, wireless devices, memory devices, application specific integrated circuits, and the like, may be alternately attached to the microelectronic substrates to form functional microelectronic packages.
    Type: Grant
    Filed: June 6, 2011
    Date of Patent: March 18, 2014
    Assignee: Intel Corporation
    Inventors: Md Altaf Hossain, Cliff C. Lee, David W. Browning, Itai M. Pines, Brian P. Kelly
  • Publication number: 20120305303
    Abstract: The present disclosure relates to microelectronic substrates, such as interposers, motherboards, test platforms, and the like, that are fabricated to have overlapping connection zones, such that different microelectronic devices, such as microprocessors, chipsets, graphics processing devices, wireless devices, memory devices, application specific integrated circuits, and the like, may be alternately attached to the microelectronic substrates to form functional microelectronic packages.
    Type: Application
    Filed: June 6, 2011
    Publication date: December 6, 2012
    Inventors: Md Altaf Hossain, Cliff C. Lee, David W. Browning, Itai M. Pines, Brian P. Kelly