Patents by Inventor Cliff CH Chuang

Cliff CH Chuang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and method for heat removal using a thermal potting solution in an information handling system
    Patent number: 11439001
    Abstract: An information handling system includes a printed circuit board (PCB), a barrier frame, thermal potting material that fills the barrier frame, and a heat removing structure embedded into the thermal potting material. The barrier frame encloses a first device, and extends to also enclose a second location of the PCB. The thermal potting material surrounds the first device. The heat removing structure includes a first pad co-located with the first device, a second pad co-located with the second location, and a thermally conductive connection between the first pad and the second pad. The heat removing structure may remove heat generated by the first device to the second pad.
    Type: Grant
    Filed: November 14, 2019
    Date of Patent: September 6, 2022
    Assignee: Dell Products L.P.
    Inventors: Iris Huang, Cliff CH Chuang
  • SYSTEM AND METHOD FOR HEAT REMOVAL USING A THERMAL POTTING SOLUTION IN AN INFORMATION HANDLING SYSTEM
    Publication number: 20210153335
    Abstract: An information handling system includes a printed circuit board (PCB), a barrier frame, thermal potting material that fills the barrier frame, and a heat removing structure embedded into the thermal potting material. The barrier frame encloses a first device, and extends to also enclose a second location of the PCB. The thermal potting material surrounds the first device. The heat removing structure includes a first pad co-located with the first device, a second pad co-located with the second location, and a thermally conductive connection between the first pad and the second pad. The heat removing structure may remove heat generated by the first device to the second pad.
    Type: Application
    Filed: November 14, 2019
    Publication date: May 20, 2021
    Inventors: Iris Huang, Cliff CH Chuang