Abstract: One or more embodiments of a combination wheel locking system are provided herein. The combination wheel locking system can be used to prevent access to one or more lug nuts on a wheel. The combination wheel locking system and anti-theft device can include a combination master lock system for operatively engaging and releasing from a portion of a wheel.

Abstract: One or more embodiments of a combination wheel locking system are provided herein. The combination wheel locking system can be used to prevent access to one or more lug nuts on a wheel. The combination wheel locking system and anti-theft device can include a combination master lock system for operatively engaging and releasing from a portion of a wheel.

Abstract: The disclosure provides a method to construct and physically join near-net shaped structural building blocks into a composite part using an interfacial reaction-activation mechanism.

Abstract: A composite textile for generating an electrophoretically driven image. The textile has at least three layers. An outer (relative to an observer of the image) electrode layer is made from a transparent and electrically conductive material. A fibermat layer is under the outer electrode layer, and comprises a mat of one or more fibers, each fiber being transparent and dielectric and having a hollow core that contains a fluid suspension of particles (typically nanoparticles) of at least two color types. A pattern layer is under the fiber mat layer, and has an arrangement of features made from an electrically conductive material. When voltage is applied to the pattern layer, the particles respond by migrating toward the outer electrode or pattern layer, depending on their charge.

Abstract: Systems and methods for dispensing an anti-traction, mobility denial material on a target surface. In various exemplary embodiments, a method of dispensing an anti-traction material on a target surface includes providing a polymer particle powder to a first section of a dispensing nozzle, providing a water stream to a second section of a dispensing nozzle, and mixing the polymer particle powder with the water stream upon exit of the streams out of the first and second sections of the dispensing nozzle to form the anti-traction material on the target surface, the formed anti-traction material being a gel.

Abstract: The disclosure provides a method to construct and physically join near-net shaped structural building blocks into a composite part using an interfacial reaction-activation mechanism.

Abstract: The present invention relates generally to methods of removal of a lubricious coating. In more specific aspects, the invention relates to methods of removal of aqueous polymers comprising acrylamide or copolymers thereof from a substrate comprising application of one or more metal salts.

Abstract: Systems and methods for dispensing an anti-traction, mobility denial material on a target surface. In various exemplary embodiments, a method of dispensing an anti-traction material on a target surface includes providing a polymer particle powder to a first section of a dispensing nozzle, providing a water stream to a second section of a dispensing nozzle, and mixing the polymer particle powder with the water stream upon exit of the streams out of the first and second sections of the dispensing nozzle to form the anti-traction material on the target surface, the formed anti-traction material being a gel.

Abstract: A semiconductor component includes a leadframe (11, 40) having leads (12, 41) and a ground plane (13, 42) wherein the ground plane (13, 42) has an opening (15, 45). A semiconductor substrate (21) is located in the opening (15, 45) and is approximately coplanar with the ground plane (13, 42). The coplanarity shortens the ground plane wire bonds (23) and improves the electrical performance of the semiconductor component.

Abstract: A method of manufacturing a semiconductor component includes forming a vertical side seal for a runner in a first mold plate by mating a protrusion of the first mold plate with a protrusion of a second mold plate. As an encapsulating material is forced through the runner, the vertical side seal prevents an encapsulating material from leaking out of the edge of the runner.

Abstract: Real time distance and pressure data of a plunger (35) relative to a mold compound is provided by a compensation assembly (29) in a mold press (10). The compensation assembly has a sliding block assembly (30) which moves substantially in the same direction as the plungers (35). The sliding block assembly (30) has pressure control cylinders (33) which limit the pressure plungers (35) can apply. If the pressure on the plungers (35) should exceed this limit, the plungers (35) retract towards the sliding block assembly (30). A sensor (37) is coupled between the sliding block assembly (30) and the plungers (35) to measure the distance the plungers have moved towards the sliding block assembly (30). In one application, the sensor (37) is formed from a linear voltage displacement transducer (LVDT) so the mold press (10) can have real time pressure and distance data.

Abstract: A method for detecting mold plate information comprises, in a preferred embodiment, detecting external physical indicia (112) identify a mold plate. The external physical indicia (112) are preferably a pattern of holes or absence of holes formed in a corner protrusion (110), attached to the corner of a mold plate (104). The holes or absence thereof represent a binary sequence identifying the mold plate (104). Preferably, the holes are optically detected by detectors (204) mounted in the guide rail (202) of a mold press.

Abstract: A method for detecting orientation of a semiconductor package (11) having a cavity (19) formed in a lower surface is described. The semiconductor package (11) is positioned in a travel path (24) of a packaging process apparatus (23). An orientation support plate (17) is provided having a protrusion (18) that is designed to fit into the cavity (19) in the semiconductor package (11). The orientation support plate (17) is moved towards the semiconductor package and the protrusion (18) fits into the cavity (19) when the semiconductor package (11) is properly oriented, and the protrusion kicks the semiconductor package (11) out of the travel path (24) when the semiconductor package (11) is mis-oriented.