Patents by Inventor Cliff Willis

Cliff Willis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Network devices and network elements with stacked octal small format pluggable modules
    Patent number: 10741943
    Abstract: In one embodiment, an apparatus is provided. The apparatus includes a printed circuit board (PCB). The apparatus also includes a first dual stacked octal small format pluggable (OSFP) module coupled to the PCB on a top surface of the PCB. The first dual stacked OSFP module comprises two OSFP modules that are vertically stacked. The apparatus further includes a second dual stacked OSFP module coupled to the PCB on a bottom surface of the PCB. The second dual stacked OSFP module comprises two OSFP modules that are vertically stacked. A first bottom of the first dual stacked OSFP module is flush against the top surface of the PCB. A second bottom of the second dual stacked OSFP is flush against the bottom surface of the PCB.
    Type: Grant
    Filed: September 13, 2018
    Date of Patent: August 11, 2020
    Assignee: ARISTA NETWORKS, INC.
    Inventors: Robert Wilcox, Richard Hibbs, Youngbae Park, Cliff Willis, Aravind Musunuri
  • NETWORK DEVICES AND NETWORK ELEMENTS WITH STACKED OCTAL SMALL FORMAT PLUGGABLE MODULES
    Publication number: 20200091633
    Abstract: In one embodiment, an apparatus is provided. The apparatus includes a printed circuit board (PCB). The apparatus also includes a first dual stacked octal small format pluggable (OSFP) module coupled to the PCB on a top surface of the PCB. The first dual stacked OSFP module comprises two OSFP modules that are vertically stacked. The apparatus further includes a second dual stacked OSFP module coupled to the PCB on a bottom surface of the PCB. The second dual stacked OSFP module comprises two OSFP modules that are vertically stacked. A first bottom of the first dual stacked OSFP module is flush against the top surface of the PCB. A second bottom of the second dual stacked OSFP is flush against the bottom surface of the PCB.
    Type: Application
    Filed: September 13, 2018
    Publication date: March 19, 2020
    Inventors: Robert Wilcox, Richard Hibbs, Youngbae Park, Cliff Willis, Aravind Musunuri