Abstract: Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for determining, for each pair of adjacent chips in a plurality of chips connected in a series-ring arrangement of a semiconductor device, a corresponding loop latency for round trip data transmissions between the pair of chips. Identifying, from among the loop latencies, a maximum loop latency. Determining a ring latency for a data transmission originating from a chip of the plurality chips to be transmitted around the series-ring arrangement and back to the chip. Comparing half of the maximum loop latency to one N-th of the ring latency, where N is the number of chips in the plurality of chips, and storing the greater value as an inter-chip latency of the semiconductor device, the inter-chip latency representing an operational characteristic of the semiconductor device.

Abstract: A method of configuring an integrated circuit including multiple hardware tiles, includes: establishing a data forwarding path through the multiple hardware tiles by configuring each hardware tile, except for a last hardware tile, of the multiple hardware tiles to be in a data forwarding state, in which configuring each hardware tile, except for the last hardware tile, to be in a forwarding state includes installing a respective forwarding state counter specifying a corresponding predefined length of time that the hardware tile is in the data forwarding state; supplying, along the data forwarding path, each hardware tile of the plurality of hardware tiles with a respective program data packet comprising program data for the hardware tile; and installing, for each hardware tile of the multiple hardware tiles, the respective program data.

Abstract: Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for determining, for each pair of adjacent chips in a plurality of chips connected in a series-ring arrangement of a semiconductor device, a corresponding loop latency for round trip data transmissions between the pair of chips. Identifying, from among the loop latencies, a maximum loop latency. Determining a ring latency for a data transmission originating from a chip of the plurality chips to be transmitted around the series-ring arrangement and back to the chip. Comparing half of the maximum loop latency to one N-th of the ring latency, where N is the number of chips in the plurality of chips, and storing the greater value as an inter-chip latency of the semiconductor device, the inter-chip latency representing an operational characteristic of the semiconductor device.

Abstract: A method of configuring an integrated circuit including multiple hardware tiles, includes: establishing a data forwarding path through the multiple hardware tiles by configuring each hardware tile, except for a last hardware tile, of the multiple hardware tiles to be in a data forwarding state, in which configuring each hardware tile, except for the last hardware tile, to be in a forwarding state includes installing a respective forwarding state counter specifying a corresponding predefined length of time that the hardware tile is in the data forwarding state; supplying, along the data forwarding path, each hardware tile of the plurality of hardware tiles with a respective program data packet comprising program data for the hardware tile; and installing, for each hardware tile of the multiple hardware tiles, the respective program data.

Abstract: Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for determining, for each pair of adjacent chips in a plurality of chips connected in a series-ring arrangement of a semiconductor device, a corresponding loop latency for round trip data transmissions between the pair of chips. Identifying, from among the loop latencies, a maximum loop latency. Determining a ring latency for a data transmission originating from a chip of the plurality chips to be transmitted around the series-ring arrangement and back to the chip. Comparing half of the maximum loop latency to one N-th of the ring latency, where N is the number of chips in the plurality of chips, and storing the greater value as an inter-chip latency of the semiconductor device, the inter-chip latency representing an operational characteristic of the semiconductor device.

Abstract: Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for determining, for each pair of adjacent chips in a plurality of chips connected in a series-ring arrangement of a semiconductor device, a corresponding loop latency for round trip data transmissions between the pair of chips. Identifying, from among the loop latencies, a maximum loop latency. Determining a ring latency for a data transmission originating from a chip of the plurality chips to be transmitted around the series-ring arrangement and back to the chip. Comparing half of the maximum loop latency to one N-th of the ring latency, where N is the number of chips in the plurality of chips, and storing the greater value as an inter-chip latency of the semiconductor device, the inter-chip latency representing an operational characteristic of the semiconductor device.

Abstract: Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for determining, for each pair of adjacent chips in a plurality of chips connected in a series-ring arrangement of a semiconductor device, a corresponding loop latency for round trip data transmissions between the pair of chips. Identifying, from among the loop latencies, a maximum loop latency. Determining a ring latency for a data transmission originating from a chip of the plurality chips to be transmitted around the series-ring arrangement and back to the chip. Comparing half of the maximum loop latency to one N-th of the ring latency, where N is the number of chips in the plurality of chips, and storing the greater value as an inter-chip latency of the semiconductor device, the inter-chip latency representing an operational characteristic of the semiconductor device.

Abstract: An example method may include receiving, from a client computing device, an indication of a target drop-off spot for an object within a first virtual model of a first region of a delivery destination. A second virtual model of a second region of the delivery destination may be determined based on sensor data received from one or more sensors on a delivery vehicle. A mapping may be determined between physical features represented in the first virtual model and physical features represented in the second virtual model to determine an overlapping region between the first and second virtual models. A position of the target drop-off spot within the second virtual model may be determined based on the overlapping region. Based on the position of the target drop-off spot within the second virtual model, the delivery vehicle may be navigated to the target drop-off spot to drop off the object.

Abstract: A method of configuring an integrated circuit including multiple hardware tiles, includes: establishing a data forwarding path through the multiple hardware tiles by configuring each hardware tile, except for a last hardware tile, of the multiple hardware tiles to be in a data forwarding state, in which configuring each hardware tile, except for the last hardware tile, to be in a forwarding state includes installing a respective forwarding state counter specifying a corresponding predefined length of time that the hardware tile is in the data forwarding state; supplying, along the data forwarding path, each hardware tile of the plurality of hardware tiles with a respective program data packet comprising program data for the hardware tile; and installing, for each hardware tile of the multiple hardware tiles, the respective program data.

Abstract: Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for determining, for each pair of adjacent chips in a plurality of chips connected in a series-ring arrangement of a semiconductor device, a corresponding loop latency for round trip data transmissions between the pair of chips. Identifying, from among the loop latencies, a maximum loop latency. Determining a ring latency for a data transmission originating from a chip of the plurality chips to be transmitted around the series-ring arrangement and back to the chip. Comparing half of the maximum loop latency to one N-th of the ring latency, where N is the number of chips in the plurality of chips, and storing the greater value as an inter-chip latency of the semiconductor device, the inter-chip latency representing an operational characteristic of the semiconductor device.

Abstract: An example method may include receiving, from a client computing device, an indication of a target drop-off spot for an object within a first virtual model of a first region of a delivery destination. A second virtual model of a second region of the delivery destination may be determined based on sensor data received from one or more sensors on a delivery vehicle. A mapping may be determined between physical features represented in the first virtual model and physical features represented in the second virtual model to determine an overlapping region between the first and second virtual models. A position of the target drop-off spot within the second virtual model may be determined based on the overlapping region. Based on the position of the target drop-off spot within the second virtual model, the delivery vehicle may be navigated to the target drop-off spot to drop off the object.

Abstract: Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for determining, for each pair of adjacent chips in a plurality of chips connected in a series-ring arrangement of a semiconductor device, a corresponding loop latency for round trip data transmissions between the pair of chips. Identifying, from among the loop latencies, a maximum loop latency. Determining a ring latency for a data transmission originating from a chip of the plurality chips to be transmitted around the series-ring arrangement and back to the chip. Comparing half of the maximum loop latency to one N-th of the ring latency, where N is the number of chips in the plurality of chips, and storing the greater value as an inter-chip latency of the semiconductor device, the inter-chip latency representing an operational characteristic of the semiconductor device.

Abstract: An example method may include receiving, from a client computing device, an indication of a target drop-off spot for an object within a first virtual model of a first region of a delivery destination. A second virtual model of a second region of the delivery destination may be determined based on sensor data received from one or more sensors on a delivery vehicle. A mapping may be determined between physical features represented in the first virtual model and physical features represented in the second virtual model to determine an overlapping region between the first and second virtual models. A position of the target drop-off spot within the second virtual model may be determined based on the overlapping region. Based on the position of the target drop-off spot within the second virtual model, the delivery vehicle may be navigated to the target drop-off spot to drop off the object.

Abstract: An example method may include receiving, from a client computing device, an indication of a target drop-off spot for an object within a first virtual model of a first region of a delivery destination. A second virtual model of a second region of the delivery destination may be determined based on sensor data received from one or more sensors on a delivery vehicle. A mapping may be determined between physical features represented in the first virtual model and physical features represented in the second virtual model to determine an overlapping region between the first and second virtual models. A position of the target drop-off spot within the second virtual model may be determined based on the overlapping region. Based on the position of the target drop-off spot within the second virtual model, the delivery vehicle may be navigated to the target drop-off spot to drop off the object.

Abstract: An example method may include receiving, from a client computing device, an indication of a target drop-off spot for an object within a first virtual model of a first region of a delivery destination. A second virtual model of a second region of the delivery destination may be determined based on sensor data received from one or more sensors on a delivery vehicle. A mapping may be determined between physical features represented in the first virtual model and physical features represented in the second virtual model to determine an overlapping region between the first and second virtual models. A position of the target drop-off spot within the second virtual model may be determined based on the overlapping region. Based on the position of the target drop-off spot within the second virtual model, the delivery vehicle may be navigated to the target drop-off spot to drop off the object.

Abstract: A balloon may include an optical-communication component, which may have a pointing axis. A pointing mechanism could be configured to adjust the pointing axis. The optical-communication component could be operable to communicate with a correspondent balloon via a free-space optical link. For example, the optical-communication component could include an optical receiver, transmitter, or transceiver. A controller could be configured to determine a predicted relative location of the correspondent balloon. The controller may control the pointing mechanism to adjust the pointing axis of the optical-communication component based on the predicted relative location so as to maintain the free-space optical link with the correspondent balloon.

Abstract: A balloon is provided having an exostructure comprised of hollow struts or rods and an envelope positioned over the exostructure, and a pump for pumping air out of the balloon to create an air pressure differential between the pressure inside the envelope and the atmospheric pressure outside the envelope, a control system configured to allow air to flow into the envelope to control the altitude of the balloon, and to operate the pump to pump air out of the envelope to control the altitude of the balloon, wherein the material of the envelope is arranged so as to sag between the struts or rods and form at least one catenary surface when there is an air pressure differential between the pressure inside of the balloon envelope and the atmospheric pressure outside the envelope.

Abstract: A balloon may include an optical-communication component, which may have a pointing axis. A pointing mechanism could be configured to adjust the pointing axis. The optical-communication component could be operable to communicate with a correspondent balloon via a free-space optical link. For example, the optical-communication component could include an optical receiver, transmitter, or transceiver. A controller could be configured to determine a predicted relative location of the correspondent balloon. The controller may control the pointing mechanism to adjust the pointing axis of the optical-communication component based on the predicted relative location so as to maintain the free-space optical link with the correspondent balloon.

Abstract: A balloon may include an optical-communication component, which may have a pointing axis. A pointing mechanism could be configured to adjust the pointing axis. The optical-communication component could be operable to communicate with a correspondent balloon via a free-space optical link. For example, the optical-communication component could include an optical receiver, transmitter, or transceiver. A controller could be configured to determine a predicted relative location of the correspondent balloon. The controller may control the pointing mechanism to adjust the pointing axis of the optical-communication component based on the predicted relative location so as to maintain the free-space optical link with the correspondent balloon.

Abstract: A balloon is provided having a balloon envelope, a payload positioned beneath the balloon envelope, and a drag plate positioned beneath the balloon envelope and attached to the payload, and a control system configured to initiate a process to cause the balloon envelope to no longer provide lift to the payload, wherein the drag plate serves to slow the descent of the payload to the earth.