Abstract: A process for the selective conversion of a polymer coating to a ceramic material is disclosed. This process initially involves the provision of a polymer film which has been generated by R. F. plasma vapor phase polymerization of a monomer comprising an inorganic (i.e. silicon) or an organometallic constituent on a receptive substrate. The polymer is thereafter selectively exposed to a coherent or focused energy source (i.e. CO.sub.2 laser) at the appropriate wavelength and power output to effect in situ conversion of a polymer film to a ceramic deposit which is substantially devoid of carbonaceous impurities. This process is also unique for its ability to provide a ceramic deposit that is firmly adherent on a variety of receptive substrates. The degree of adherence is far superior to ceramic coatings derived by chemical vapor deposition (CVD) techniques. The process lends itself to the formation of ceramic patterns which have application in the microelectronics industry.