Patents by Inventor Clifford M. Howard

Clifford M. Howard has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device having a bond pad
    Patent number: 5814893
    Abstract: Bond pads (394, 106) and bond pad openings (62, 108) are formed such that the bond pad openings (62, 108) are asymmetric to the conductive sections (398, 106) of the bond pads (394, 106). If the bond pads are more likely to lift from the scribe line side of the bond pad (394, 106), the bond pad openings (62, 108) are formed such that the passivation layer (52) overlies more of the conductive section (398, 106) near the scribe line (40). If the bond pads (394, 106) are more likely to lift from the other side, the passivation layer (52) overlies more of the other side of the conductive section (398, 106). In addition to reducing the risk of lifting, contamination problems should also be reduced.
    Type: Grant
    Filed: February 13, 1997
    Date of Patent: September 29, 1998
    Assignee: Motorola Inc.
    Inventors: Ting-Chen Hsu, Edward O. Travis, Clifford M. Howard, Stephen G. Jamison
  • Process for forming a semiconductor device having a bond pad
    Patent number: 5661082
    Abstract: Bond pads (394, 106) and bond pad openings (62, 108) are formed such that the bond pad openings (62, 108) are asymmetric to the conductive sections (398, 106) of the bond pads (394, 106). If the bond pads are more likely to lift from the scribe line side of the bond pad (394, 106), the bond pad openings (62, 108) are formed such that the passivation layer (52) overlies more of the conductive section (398, 106) near the scribe line (40). If the bond pads (394, 106) are more likely to lift from the other side, the passivation layer (52) overlies more of the other side of the conductive section (398, 106). In addition to reducing the risk of lifting, contamination problems should also be reduced.
    Type: Grant
    Filed: January 20, 1995
    Date of Patent: August 26, 1997
    Assignee: Motorola, Inc.
    Inventors: Ting-Chen Hsu, Edward O. Travis, Clifford M. Howard, Stephen G. Jamison