Abstract: The present application discloses a fixture-free, hands-free soldering apparatus having a base support assembly and a solder assembly. The base support assembly has a base member supporting a power supply and an electronic temperature, time and speed control system, and an actuator for remotely actuating the solder assembly without the use of the operator's hands or fixtures. The solder assembly is supported on the base member by vertically movable support arms. A main body supports a spool of solder, a solder feed mechanism operated by the actuator and a solder mechanism having adjustable operating temperature, speed and position. The main body and adjustable solder mechanism of the solder assembly adjust the angle and position of the solder being fed by the solder feed mechanism and an adjustable solder head supporting a concave solder tip. In addition to vertical movement, the main body is rotatable by about 60 degrees with respect to a central horizontal plane along the main body.