Abstract: In the fabrication of a circuit device including a substrate for providing connections between connection pins to be bonded to I/O pads on one side of the substrate and chips to be bonded to pads on the other side of the substrate, bonding is achieved simultaneously on both sides of the substrate by using a pin holder on an upper side of the substrate and using the surface tension of a flux to adhere and finely position the chips on the lower side of the substrate. The same or a modified technique may be used for the replacement of chips during repair of the circuit device. Repair of damaged or defective pin bonds yields a bond which is structurally and electrically improved in comparison with the originally formed bond.