Abstract: A polishing pad comprising particles having an average diameter between 1 nanometer and 100 nanometers, wherein the total weight of the particles is greater than about 3% of the total weight of the pad. Also, a method of manufacturing a polishing pad comprises the steps of: mixing a pre-polymer and abrasive particles together; wherein the abrasive particles have an average diameter of between 1 nanometer and 100 nanometers in diameter, and wherein the abrasive particles comprise more than about 3% by weight of the polishing pad; mixing a curative with the mixed pre-polymer and particles; and pouring the mixture of pre-polymer, particles and curative into a mold. In one exemplary embodiment the particles are silica and the pre-polymer is a polyurethane pre-polymer.

Abstract: A polishing/lapping pad for use in CMP and other polishing and lapping operations is presented that comprises multiple channels designed to facilitate in the manipulation of slurry into specific locations on the wafer being planarized.