Abstract: A packaging insert includes a frame that is configured to occupy a selected amount of space within a container at least in an area corresponding to a periphery of the container contents, such as silicon wafers. The packing insert includes a plurality of spring members projecting from the frame at an oblique angle relative to a reference surface on the frame. The spring members are configured to flex or move responsive to contact with a surface on the container as the container is closed. The resiliency of the spring members provides a secure positioning of the packaging insert within the container that facilitates maintaining the contents of the container, such as silicon wafers, in a desired condition within the container.

Abstract: A disk holding device according to an exemplary aspect of the present disclosure includes, among other things, a cassette that includes an interior and an end wall and a cover that is received against the cassette to at least partially cover the interior, the cover having a latch arm that includes a channel established by a first edge wall and a second edge wall, the channel receiving a complementary portion formed in the end wall of the cassette. The first edge wall is received against an interior surface of the end wall that faces toward the interior and the second edge wall is received against an exterior surface of the end wall that faces away from the interior.

Abstract: A disk holding device according to an exemplary aspect of the present disclosure includes, among other things, a cassette that includes an interior and an end wall and a cover that is received against the cassette to at least partially cover the interior, the cover having a latch arm that includes a channel established by a first edge wall and a second edge wall, the channel receiving a complementary portion formed in the end wall of the cassette. The first edge wall is received against an interior surface of the end wall that faces toward the interior and the second edge wall is received against an exterior surface of the end wall that faces away from the interior.

Abstract: A disk holding device for packaging hard drive disks includes a base, a cassette that is received against the base and a cover that is received over the cassette. The base includes a first locking surface. The cover includes a latch arm near an end of the cover. The latch arm has a second locking surface against which the first locking surface is received to secure the base and the cover together. At least one of the first locking surface or the second locking surface is moveable in an inward direction toward an interior of the cassette to unlock the locking surfaces so that the base and cover can be separated to open the disk holding device.

Abstract: A disk separator device for stacking semiconductor wafers includes a first portion having a disk support surface for accepting one side of a disk and a second portion including a guiding surface obliquely oriented to the disk support surface. The guiding surface has a first edge adjacent a curvilinear perimeter of the wafer support surface and a second edge spaced outwardly from the first edge. The separator device is nestingly received adjacent other separators to maintain a desired alignment of a stack of disks and separators.

Abstract: A plastic cushion pad (40) includes at least one plastic spring portion (46) between oppositely facing contact surfaces (42, 44). In one example, the pad (40) is vacuum formed using a film of carbon-impregnated polystyrene material. The plastic spring portion (46) is configured to provide the desired amount of resiliency or cushion provided by the pad responsive to a compressive force. In one example, the plastic spring portion is designed to prevent any lateral deformation of the pad when a compressive force is applied.

Abstract: A platform (40) has a rigid body with an adjustable thickness (t) to selectively occupy any remaining space within a container (20) used for packaging items such as semiconductor wafers (22). The platform (40) in one example has a first portion (42) and a second portion (44). Adjusting the positions of the first and second portions (42, 44) relative to each other selectively varies the thickness (t) of the platform (40) to achieve the desired thickness.

Abstract: A container for packaging items such as semiconductor wafers has a restraining portion with a changeable dimension at an open end that facilitates using conventional loading techniques while also more securely containing the items to avoid undesirable movement of the items in the container. In one example embodiment, the restraining portion includes a sidewall portion that has a first, nominal inside dimension at one end. A second end of the sidewall portion has a second, greater inside dimension at an open end. Another member of the container cooperates with the sidewall portion to change the inside dimension at the open end from the second, greater dimension to the first, nominal dimension. The nominal dimension is selected to correspond to an exterior dimension of the items to be contained within the package so that the container maintains the items in a secure alignment that eliminates lateral movement of the items once the container is secured.

Abstract: A platform (40) has a rigid body with an adjustable thickness (t) to selectively occupy any remaining space within a container (20) used for packaging items such as semiconductor wafers (22). The platform (40) in one example has a first portion (42) and a second portion (44). Adjusting the positions of the first and second portions (42, 44) relative to each other selectively varies the thickness (t) of the platform (40) to achieve the desired thickness.

Abstract: A plastic cushion pad (40) includes at least one plastic spring portion (46) between oppositely facing contact surfaces (42, 44). In one example, the pad (40) is vacuum formed using a film of carbon-impregnated polystyrene material. The plastic spring portion (46) is configured to provide the desired amount of resiliency or cushion provided by the pad responsive to a compressive force. In one example, the plastic spring portion is designed to prevent any lateral deformation of the pad when a compressive force is applied.

Abstract: A container for packaging items such as semiconductor wafers has a restraining portion with a changeable dimension at an open end that facilitates using conventional loading techniques while also more securely containing the items to avoid undesirable movement of the items in the container. In one example embodiment, the restraining portion includes a sidewall portion that has a first, nominal inside dimension at one end. A second end of the sidewall portion has a second, greater inside dimension at an open end. Another member of the container cooperates with the sidewall portion to change the inside dimension at the open end from the second, greater dimension to the first, nominal dimension. The nominal dimension is selected to correspond to an exterior dimension of the items to be contained within the package so that the container maintains the items in a secure alignment that eliminates lateral movement of the items once the container is secured.

Abstract: A component carrier tray for holding electrical components includes a support frame and a pocket insert supported by the support frame. The frame has at least one opening or concavity therein. The pocket insert is located in the opening or concavity and is formed of a high temperature semi-crystalline polymer. Each pocket insert is adapted to receive and hold at least one electrical component.

Abstract: A component carrier for holding a component includes a carrier substrate and a pocket recessed in the substrate for holding the component in its interior. The pocket has a wall and a floor, and the wall includes a series of elongated arcuate channels. The channels are concave relative to the pocket interior and extend substantially perpendicular to the pocket floor. The wall is substantially flat between the channels. A substantially continuous pedestal projects from the pocket floor. The pedestal has (i) an upper surface for supporting the component, (ii) a pair of support walls extending from the pocket floor and terminating in the support surface, and (iii) a notched portion intermediate the pedestal and defined by a lateral support member extending between the support walls and spaced from the pocket floor, for absorbing lateral components of compressive forces applied to the pedestal.

Abstract: A component carrier for holding a component includes a carrier substrate and a pocket recessed in the substrate for holding the component in its interior. The pocket has a wall and a floor, and the wall includes a series of elongated arcuate channels. The channels are concave relative to the pocket interior and extend substantially perpendicular to the pocket floor. The wall is substantially flat between the channels. A substantially continuous pedestal projects from the pocket floor. The pedestal has (i) an upper surface for supporting the component, (ii) a pair of support walls extending from the pocket floor and terminating in the support surface, and (iii) a notched portion intermediate the pedestal and defined by a lateral support member extending between the support walls and spaced from the pocket floor, for absorbing lateral components of compressive forces applied to the pedestal.

Abstract: A component carrier, for holding for purposes of automated visual inspection an electrical component having a lead with a free end, includes a carrier substrate and a pocket recessed in the substrate for holding the component in the interior of the pocket. The pocket includes a wall, depending from the carrier substrate and defining a lateral boundary of the pocket, and a bottom. There is a lead-tip horizontal plane and a lead-tip vertical plane when a correctly constructed component of the type the carrier is intended to hold is properly oriented in the pocket. The lead-tip vertical plane is perpendicular to a longitudinal axis of the pocket. The wall slopes down and inwardly at a first angle relative to the substrate through the lead-tip horizontal plane and at a second angle relative to the substrate through the lead-tip vertical plane. The first angle is greater than or equal to approximately 75.degree. and less than or equal to 90.degree., and the second angle is less than 90.degree.