Abstract: A spring loaded microwave interconnector (SLMI). The SLMI includes a waveguide probe head having a first side and opposite thereto a second side, the sides transverse to a central axis. A spring loaded coax central conductor coupled to the probe head first side and provides a distal conductive tip. The coax central conductor extends along the central axis. A dielectric sleeve is disposed about the coax central conductor adjacent to the first side. The distal conductive tip extending beyond the dielectric sleeve when in an extended position and is about flush with the dielectric sleeve when in a compressed poison. An multiport waveguide to multiport PCB assembly utilizing a plurality of SLMIs wherein the multiport waveguide and PCB have curved contours is also disclosed.

Abstract: A distributed control system for an active array antenna system is disclosed. In an exemplary embodiment, the array system employs many transmit/receive (T/R) modules each with an associated radiator element, a phase shifter element and a set of RF switch elements to set the module to transmit or receive modes. The array system is arranged to generate a transmit or receive array beam. The distributed control system in an exemplary embodiment includes an array processor for controlling the array, the processor configured to generate command signals to set the T/R module elements to transmit or receive mode and to steer the array beam to a desired direction. The command signals to steer the array beam include phase slopes common to all T/R modules in a given array or subarray.

Abstract: Methods for assembling an active array system are described. In one exemplary embodiment, an active subarray panel assembly having a first surface with a first array of electrical contacts and a radiator aperture with an array of radiator structure and an aperture mounting surface with a second array of electrical contacts are assembled together. The first surface of the panel assembly and the aperture mounting surface of the radiator aperture are brought into contact with an adhesive layer including microwave interconnects in a pattern corresponding to the first array of electrical contacts and the second array of electrical contacts so that the adhesive layer is between the first surface of the panel assembly and the aperture mounting surface of the radiator aperture. Pressure, heat and vacuum are applied to cure the adhesive and complete engagement of the microwave interconnects.

Abstract: In one or more embodiments, a method of producing a stacked integrated circuit assembly includes providing a substrate having a top surface with at least one substrate connection pad. A first flip chip integrated circuit (FFIC) is disposed above the substrate, and a second flip chip integrated circuit (SFIC) is disposed above the FFIC. The FFIC may be disposed between the substrate and the SFIC. The method includes making at least one solder connection between the substrate connection pad and the FFIC and at least one solder connection between the FFIC and the SFIC.

Abstract: Methods for assembling an active array system are described. In one exemplary embodiment, an active subarray panel assembly having a first surface with a first array of electrical contacts and a radiator aperture with an array of radiator structure and an aperture mounting surface with a second array of electrical contacts are assembled together. The first surface of the panel assembly and the aperture mounting surface of the radiator aperture are brought into contact with an adhesive layer including microwave interconnects in a pattern corresponding to the first array of electrical contacts and the second array of electrical contacts so that the adhesive layer is between the first surface of the panel assembly and the aperture mounting surface of the radiator aperture. Pressure, heat and vacuum are applied to cure the adhesive and complete engagement of the microwave interconnects.

Abstract: A stacked integrated circuit assembly includes a substrate having a top surface with at least one substrate connection pad. A first flip chip integrated circuit (FFIC) is disposed above the substrate, and a second flip chip integrated circuit (SFIC) is disposed above the FFIC. The FFIC is disposed between the substrate and the SFIC. The stacked integrated circuit assembly includes least one solder connection between the substrate connection pad and the FFIC and at least one solder connection between the FFIC and the SFIC.

Abstract: A space-fed array is selectively operable in a reflective mode or in a feed-through mode. The array includes, in an exemplary embodiment, a primary array; and a feed array. The primary array includes a first side set of radiating elements, a first set of phase shifters, a set of switches, a second set of phase shifters and a second side set of radiating elements. Each of the switches is connected between corresponding ones of the first set and the second set of phase shifters and ground, selectively settable at an open position or at a closed position. The open position corresponds to the feed through mode, and the closed position corresponds to the reflective mode.

Abstract: A space-fed conformal array for a high altitude airship includes a primary array lens assembly adapted for conformal mounting to a non-planar airship surface. The lens assembly includes a first set of radiator elements and a second set of radiator elements, the first set and the second set spaced apart by a spacing distance. The first set of radiators faces outwardly from the airship surface to provide a radiating aperture. The second set of radiators faces inwardly toward an inner space of the airship, for illumination by a feed array spaced from the second set of radiators.

Abstract: An exemplary embodiment of a dual band antenna array includes a folded thin circuit board structure with a thin dielectric layer and a conductor layer pattern formed on a first surface of the dielectric layer, the circuit board structure folded in a plurality of folds to form a pleated structure. A first array of radiator structures on the first surface is configured for operation in a first frequency band in a first polarization sense. A second array of radiator structures is configured for operation in a second frequency band in a second polarization sense. A conductor trace pattern is formed on the folded circuit board to carry control signals, DC power and RF signals. Active RF circuit devices are attached to the folded circuit board in signal communication with the conductor trace pattern.

Abstract: A phased array antenna adapted to be mounted in a helmet. In the illustrative embodiment, the antenna comprises a substrate and an array of radiating elements disposed on said substrate, each of the elements including a-resonant cavity and a mechanism for feeding the cavity with an electromagnetic signal., The cavity is formed in a multi-layer structure between a ground plane and a layer of metallization. A radiating slot or slots are provided in the layer of metallization. A first layer of dielectric material is disposed within the cavity. The feed mechanism is a microstrip feed disposed in the first layer of dielectric material parallel to a plane of a portion of the substrate over which an associated element is disposed. A layer of foam is disposed between the layer of dielectric material and the ground plane. Second and third parallel layers of dielectric material are included in each element. The second layer is disposed adjacent to the ground plane.

Abstract: An antenna array includes a folded thin flexible circuit board with a thin dielectric layer and a conductor layer pattern formed on a first surface of the dielectric layer. The circuit board may be folded in a plurality of folds to form a pleated structure. An array of radiator structures is formed on the first surface, A conductor trace pattern is formed on the folded circuit board. A plurality of active RF circuit devices is attached to the folded circuit board in signal communication with the conductor trace pattern.

Abstract: Methods for assembling an active array system are described. In one exemplary embodiment, an active subarray panel assembly having a first surface with a first array of electrical contacts and a radiator aperture with an array of radiator structure and an aperture mounting surface with a second array of electrical contacts are assembled together. The first surface of the panel assembly and the aperture mounting surface of the radiator aperture are brought into contact with an adhesive layer including microwave interconnects in a pattern corresponding to the first array of electrical contacts and the second array of electrical contacts so that the adhesive layer is between the first surface of the panel assembly and the aperture mounting surface of the radiator aperture. Pressure, heat and vacuum are applied to cure the adhesive and complete engagement of the microwave interconnects.

Abstract: A spring loaded microwave interconnector (SLMI). The SLMI includes a waveguide probe head having a first side and opposite thereto a second side, the sides transverse to a central axis. A spring loaded coax central conductor coupled to the probe head first side and provides a distal conductive tip. The coax central conductor extends along the central axis. A dielectric sleeve is disposed about the coax central conductor adjacent to the first side. The distal conductive tip extending beyond the dielectric sleeve when in an extended position and is about flush with the dielectric sleeve when in a compressed poison. An multiport waveguide to multiport PCB assembly utilizing a plurality of SLMIs wherein the multiport waveguide and PCB have curved contours is also disclosed.

Abstract: A phased array antenna adapted to be mounted in a helmet. In the illustrative embodiment, the antenna comprises a substrate and an array of radiating elements disposed on said substrate, each of the elements including a-resonant cavity and a mechanism for feeding the cavity with an electromagnetic signal., The cavity is formed in a multi-layer structure between a ground plane and a layer of metallization. A radiating slot or slots are provided in the layer of metallization. A first layer of dielectric material is disposed within the cavity. The feed mechanism is a microstrip feed disposed in the first layer of dielectric material parallel to a plane of a portion of the substrate over which an associated element is disposed. A layer of foam is disposed between the layer of dielectric material and the ground plane. Second and third parallel layers of dielectric material are included in each element. The second layer is disposed adjacent to the ground plane.

Abstract: A stacked integrated circuit assembly includes a substrate having a top surface with at least one substrate connection pad. A first flip chip integrated circuit (FFIC) is disposed above the substrate, and a second flip chip integrated circuit (SFIC) is disposed above the FFIC. The FFIC is disposed between the substrate and the SFIC. The stacked integrated circuit assembly includes least one solder connection between the substrate connection pad and the FFIC and at least one solder connection between the FFIC and the SFIC.

Abstract: An antenna array includes a folded thin flexible circuit board with a thin dielectric layer and a conductor layer pattern formed on a first surface of the dielectric layer. The circuit board may be folded in a plurality of folds to form a pleated structure. An array of radiator structures is formed on the first surface, A conductor trace pattern is formed on the folded circuit board. A plurality of active RF circuit devices is attached to the folded circuit board in signal communication with the conductor trace pattern.

Abstract: A dual-band, space fed antenna array includes a feed array with a first set of feed radiators for operation in a first frequency band of operation and a second set of feed radiators for operation in a second frequency band of operation. A primary array lens assembly is spaced from and illuminated by the feed array. The primary array lens includes a first set of radiator elements and a second set of radiator elements operable in the first frequency band of operation. The primary array lens assembly also includes a third set of radiator elements and a fourth set of radiator elements operable in the second frequency band of operation.

Abstract: A dual-band, space fed antenna array includes a feed array with a first set of feed radiators for operation in a first frequency band of operation and a second set of feed radiators for operation in a second frequency band of operation. A primary array lens assembly is spaced from and illuminated by the feed array. The primary array lens includes a first set of radiator elements and a second set of radiator elements operable in the first frequency band of operation. The primary array lens assembly also includes a third set of radiator elements and a fourth set of radiator elements operable in the second frequency band of operation.

Abstract: A space-fed array is selectively operable in a reflective mode or in a feed-through mode. The array includes, in an exemplary embodiment, a primary array; and a feed array. The primary array includes a first side set of radiating elements, a first set of phase shifters, a set of switches, a second set of phase shifters and a second side set of radiating elements. Each of the switches is connected between corresponding ones of the first set and the second set of phase shifters and ground, selectively settable at an open position or at a closed position. The open position corresponds to the feed through mode, and the closed position corresponds to the reflective mode.

Abstract: A space-fed conformal array for a high altitude airship includes a primary array lens assembly adapted for conformal mounting to a non-planar airship surface. The lens assembly includes a first set of radiator elements and a second set of radiator elements, the first set and the second set spaced apart by a spacing distance. The first set of radiators faces outwardly from the airship surface to provide a radiating aperture. The second set of radiators faces inwardly toward an inner space of the airship, for illumination by a feed array spaced from the second set of radiators.