Patents by Inventor Clifton Teik Lyk Law

Clifton Teik Lyk Law has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-die IC package and manufacturing method
    Patent number: 7816775
    Abstract: A method for of manufacturing integrated circuit packages and a multi-chip integrated circuit package are disclosed. According to the method, a first die is attached onto a first side of a set of leads of a leadframe, and an adhesive is applied onto the set of leads at a second side opposite to the first side. A second die is attached onto the adhesive. The adhesive fills into the gaps defined by the set of leads. The adhesive is thereafter cured. In a multi-chip integrated circuit package made according to the method, the adhesive attaching the second die fills the gaps between the leads so that to avoid formation of internal cavities of the package.
    Type: Grant
    Filed: September 9, 2005
    Date of Patent: October 19, 2010
    Assignee: United Test and Assembly Center Limited
    Inventors: Chuen Khiang Wang, Hao Liu, Hien Boon Tan, Clifton Teik Lyk Law, Rahamat Bidin, Anthony Yi Sheng Sun
  • Multi-Die Ic Package and Manufacturing Method
    Publication number: 20080150103
    Abstract: A method for of manufacturing integrated circuit packages and a multi-chip integrated circuit package are disclosed. According to the method, a first die is attached onto a first side of a set of leads of a leadframe, and an adhesive is applied onto the set of leads at a second side opposite to the first side. A second die is attached onto the adhesive. The adhesive fills into the gaps defined by the set of leads. The adhesive is thereafter cured. In a multi-chip integrated circuit package made according to the method, the adhesive attaching the second die fills the gaps between the leads so that to avoid formation of internal cavities of the package.
    Type: Application
    Filed: September 9, 2005
    Publication date: June 26, 2008
    Inventors: Chuen Khiang Wang, Hao Liu, Hien Boon Tan, Clifton Teik Lyk Law, Rahamat Bidin, Anthony Yi Shen Sun