Abstract: A very thin gold coating (e.g., 270 to 3,500 Angstroms) is vapor deposited on the surface of a nickel substrate. A short radiant energy pulse from a laser having a pulse length of about 130 nanoseconds is directed at the coated surface to melt portions of the gold coating and the nickel substrate therebelow. The energy pulse is removed to permit the melted material to resolidify as an alloy with a high concentration of gold at the surface thereof.

Abstract: Substrates for use in electrical contacts are prepared prior to plating by rapid surface melting by means of a laser beam or an electron beam. Improved microscopic surface characteristics are obtained. In a preferred embodiment, improved macroscopic surface roughness characteristics are also obtained by shorter-duration melting, typically by means of a pulsed YAG laser. Gold which has been electroplated onto copper alloys prepared by this technique has shown improved resistance to sulfur and chlorine corrosive atmospheres. This allows, for example, a thinner layer of a protective metal to be used to obtain a given degree of protection.