Patents by Inventor Clint G. Buckman

Clint G. Buckman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9992911
    Abstract: A thermal transfer system for reducing temperature cycling of an electronic device. The thermal system includes a thermally conductive device to which the electronic device is mounted, a heat sink and a thermal rail mounted to the heat sink. The thermal system further includes a plurality of shape memory alloy (SMA) elements extending through aligned openings in the rail and the thermally conductive device, where the SMA elements are shaped in a deformed wire-like configuration and attempt to return to an undeformed spring-like configuration when the plurality of SMA elements are heated above a transition temperature so as to increase a heat transfer contact pressure between the thermally conductive device and the rail.
    Type: Grant
    Filed: May 17, 2017
    Date of Patent: June 5, 2018
    Assignee: Northrop Grumman Systems Corporation
    Inventors: Clint G. Buckman, Alex Chov, Matthew Kim, Hamahito Hokyo, Vinh Tran, David Bothman
  • Patent number: 9036353
    Abstract: A planar heat pipe for removing heat from an electronic device. The heat pipe includes a planar portion defining a cool end of the heat pipe and a plate portion mounted to the electronic device and defining a hot end of the heat pipe. The heat pipe also includes a serpentine portion coupled to the planar portion and the plate portion, where each of the planar portion, the plate portion and the serpentine portion include an internal chamber being in fluid communication with each other and containing a working fluid. The serpentine portion can include a plurality of elements where each element is coupled to an adjacent element at substantially a 90° angle so as to allow the serpentine portion to flex in three-degrees of freedom.
    Type: Grant
    Filed: November 26, 2012
    Date of Patent: May 19, 2015
    Assignee: Northrop Grumman Systems Corporation
    Inventors: Clint G. Buckman, Katrina M. Seitz, Christofer Bronnenberg
  • Publication number: 20140146475
    Abstract: A planar heat pipe for removing heat from an electronic device. The heat pipe includes a planar portion defining a cool end of the heat pipe and a plate portion mounted to the electronic device and defining a hot end of the heat pipe. The heat pipe also includes a serpentine portion coupled to the planar portion and the plate portion, where each of the planar portion, the plate portion and the serpentine portion include an internal chamber being in fluid communication with each other and containing a working fluid. The serpentine portion can include a plurality of elements where each element is coupled to an adjacent element at substantially a 90° angle so as to allow the serpentine portion to flex in three-degrees of freedom.
    Type: Application
    Filed: November 26, 2012
    Publication date: May 29, 2014
    Applicant: Northrop Grumman Systems Corporation
    Inventors: Clint G. Buckman, Katrina M. Seitz, Christofer Bronnenberg