Patents by Inventor Clint Thomas
Clint Thomas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9287110Abstract: A semiconductor wafer electroless plating apparatus includes a platen and a fluid bowl. The platen has a top surface defined to support a wafer, and an outer surface extending downward from a periphery of the top surface to a lower surface of the platen. The fluid bowl has an inner volume defined by an interior surface so as to receive the platen, and wafer to be supported thereon, within the inner volume. A seal is disposed around the interior surface of the fluid bowl so as to form a liquid tight barrier when engaged between the interior surface of the fluid bowl and the outer surface of the platen. A number of fluid dispense nozzles are positioned to dispense electroplating solution within the fluid bowl above the seal so as to rise up and flow over the platen, thereby flowing over the wafer when present on the platen.Type: GrantFiled: June 14, 2013Date of Patent: March 15, 2016Assignee: Lam Research CorporationInventors: William Thie, John M. Boyd, Fritz C. Redeker, Yezdi Dordi, John Parks, Tiruchirapalli Arunagiri, Aleksander Owczarz, Todd Balisky, Clint Thomas, Jacob Wylie, Alan M. Schoepp
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Publication number: 20150040947Abstract: An apparatus for cleaning a substrate is disclosed. The apparatus having a first head unit and a second head unit. The first head unit is positioned proximate to the surface of the substrate and has a first row of channels defined within configured to supply a foam to the surface of the substrate. The second head unit is positioned substantially adjacent to the first head unit and proximate to the surface of the substrate. A second and a third row of channels are defined within the second head unit. The second row of channels is configured to supply a fluid to the surface of the substrate. The third row of channels is configured to apply a vacuum to the surface of the substrate.Type: ApplicationFiled: August 7, 2013Publication date: February 12, 2015Applicant: Lam Research CorporationInventors: Erik M. Freer, John M. deLarios, Katrina Mikhaylichenko, Michael Ravkin, Mikhail Korolik, Fred C. Redeker, Clint Thomas, John Parks
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Patent number: 8844461Abstract: A chemical fluid handling system is defined to supply a number of chemicals to a number of fluid inputs of a mixing manifold. The chemical fluid handling system includes a number of fluid recirculation loops for separately pre-conditioning and controlling the supply of each of the number of chemicals. Each of the fluid recirculation loops is defined to degas, heat, and filter a particular one of the number of chemical components. The mixing manifold is defined to mix the number of chemicals to form the electroless plating solution. The mixing manifold includes a fluid output connected to a supply line. The supply line is connected to supply the electroless plating solution to a fluid bowl within an electroless plating chamber.Type: GrantFiled: April 16, 2007Date of Patent: September 30, 2014Assignee: Lam Research CorporationInventors: William Thie, John M. Boyd, Fritz C. Redeker, Yezdi Dordi, John Parks, Tiruchirapalli Arunagiri, Aleksander Owczarz, Todd Balisky, Clint Thomas, Jacob Wylie, Alan M. Schoepp
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Publication number: 20130280917Abstract: A semiconductor wafer electroless plating apparatus includes a platen and a fluid bowl. The platen has a top surface defined to support a wafer, and an outer surface extending downward from a periphery of the top surface to a lower surface of the platen. The fluid bowl has an inner volume defined by an interior surface so as to receive the platen, and wafer to be supported thereon, within the inner volume. A seal is disposed around the interior surface of the fluid bowl so as to form a liquid tight barrier when engaged between the interior surface of the fluid bowl and the outer surface of the platen. A number of fluid dispense nozzles are positioned to dispense electroplating solution within the fluid bowl above the seal so as to rise up and flow over the platen, thereby flowing over the wafer when present on the platen.Type: ApplicationFiled: June 14, 2013Publication date: October 24, 2013Inventors: William Thie, John M. Boyd, Fritz C. Redeker, Yezdi Dordi, John Parks, Tiruchirapalli Arunagiri, Aleksander Owczarz, Todd Balisky, Clint Thomas, Jacob Wylie, Alan M. Schoepp
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Patent number: 8555903Abstract: A cleaning material is disposed over a substrate. The cleaning material includes solid components dispersed within a liquid medium. A force is applied to the solid components within the liquid medium to bring the solid components within proximity to contaminants present on the substrate. The force applied to the solid components can be exerted by an immiscible component within the liquid medium. When the solid components are brought within sufficient proximity to the contaminants, an interaction is established between the solid components and the contaminants. Then, the solid components are moved away from the substrate such that the contaminants having interacted with the solid components are removed from the substrate.Type: GrantFiled: November 17, 2009Date of Patent: October 15, 2013Assignee: Lam Research CorporationInventors: Erik M. Freer, John M. de Larios, Katrina Mikhaylichenko, Michael Ravkin, Mikhail Korolik, Fred C. Redeker, Clint Thomas, John Parks
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Patent number: 8522799Abstract: An apparatus for cleaning a substrate is disclosed. The apparatus having a first head unit and a second head unit. The first head unit is positioned proximate to the surface of the substrate and has a first row of channels defined within configured to supply a foam to the surface of the substrate. The second head unit is positioned substantially adjacent to the first head unit and proximate to the surface of the substrate. A second and a third row of channels are defined within the second head unit. The second row of channels is configured to supply a fluid to the surface of the substrate. The third row of channels is configured to apply a vacuum to the surface of the substrate.Type: GrantFiled: September 15, 2006Date of Patent: September 3, 2013Assignee: Lam Research CorporationInventors: Erik M. Freer, John M. de Larios, Katrina Mikhaylichenko, Michael Ravkin, Mikhail Korolik, Fred C. Redeker, Clint Thomas, John Parks
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Patent number: 8485120Abstract: A semiconductor wafer electroless plating apparatus includes a platen and a fluid bowl. The platen has a top surface defined to support a wafer, and an outer surface extending downward from a periphery of the top surface to a lower surface of the platen. The fluid bowl has an inner volume defined by an interior surface so as to receive the platen, and wafer to be supported thereon, within the inner volume. A seal is disposed around the interior surface of the fluid bowl so as to form a liquid tight barrier when engaged between the interior surface of the fluid bowl and the outer surface of the platen. A number of fluid dispense nozzles are positioned to dispense electroplating solution within the fluid bowl above the seal so as to rise up and flow over the platen, thereby flowing over the wafer when present on the platen.Type: GrantFiled: April 16, 2007Date of Patent: July 16, 2013Assignee: Lam Research CorporationInventors: William Thie, John M. Boyd, Fritz C. Redeker, Yezdi Dordi, John Parks, Tiruchirapalli Arunagiri, Aleksander Owczarz, Todd Balisky, Clint Thomas, Jacob Wylie, Alan M. Schoepp
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Patent number: 8314027Abstract: A dry-in/dry-out system is disclosed for wafer electroless plating. The system includes an upper zone for wafer ingress/egress and drying operations. Proximity heads are provided in the upper zone to perform the drying operations. The system also includes a lower zone for electroless plating operations. The lower zone includes an electroless plating apparatus that implements a wafer submersion by fluid upwelling method. The upper and lower zones of the system are enclosed by a dual-walled chamber, wherein the inner wall is a chemically inert plastic and the outer wall is a structural metal. The system interfaces with a fluid handling system which provides the necessary chemistry supply and control for the system. The system is ambient controlled. Also, the system interfaces with an ambient controlled managed transfer module (MTM).Type: GrantFiled: October 28, 2011Date of Patent: November 20, 2012Assignee: Lam Research CorporationInventors: William Thie, John M. Boyd, Fritz C. Redeker, Yezdi Dordi, John Parks, Tiruchirapalli Arunagiri, Aleksander Owczarz, Todd Balisky, Clint Thomas, Jacob Wylie, Alan M. Schoepp
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Publication number: 20120045897Abstract: A dry-in/dry-out system is disclosed for wafer electroless plating. The system includes an upper zone for wafer ingress/egress and drying operations. Proximity heads are provided in the upper zone to perform the drying operations. The system also includes a lower zone for electroless plating operations. The lower zone includes an electroless plating apparatus that implements a wafer submersion by fluid upwelling method. The upper and lower zones of the system are enclosed by a dual-walled chamber, wherein the inner wall is a chemically inert plastic and the outer wall is a structural metal. The system interfaces with a fluid handling system which provides the necessary chemistry supply and control for the system. The system is ambient controlled. Also, the system interfaces with an ambient controlled managed transfer module (MTM).Type: ApplicationFiled: October 28, 2011Publication date: February 23, 2012Applicant: Lam Research CorporationInventors: William Thie, John M. Boyd, Fritz C. Redeker, Yezdi Dordi, John Parks, Tiruchirapalli Arunagiri, Aleksander Owczarz, Todd Balisky, Clint Thomas, Jacob Wylie, Alan M. Schoepp
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Patent number: 8069813Abstract: A dry-in/dry-out system is disclosed for wafer electroless plating. The system includes an upper zone for wafer ingress/egress and drying operations. Proximity heads are provided in the upper zone to perform the drying operations. The system also includes a lower zone for electroless plating operations. The lower zone includes an electroless plating apparatus that implements a wafer submersion by fluid upwelling method. The upper and lower zones of the system are enclosed by a dual-walled chamber, wherein the inner wall is a chemically inert plastic and the outer wall is a structural metal. The system interfaces with a fluid handling system which provides the necessary chemistry supply and control for the system. The system is ambient controlled. Also, the system interfaces with an ambient controlled managed transfer module (MTM).Type: GrantFiled: April 16, 2007Date of Patent: December 6, 2011Assignee: Lam Research CorporationInventors: William Thie, John M. Boyd, Fritz C. Redeker, Yezdi Dordi, John Parks, Tiruchirapalli Arunagiri, Aleksander Owczarz, Todd Balisky, Clint Thomas, Jacob Wylie, Alan M. Schoepp
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Publication number: 20100059088Abstract: A cleaning material is disposed over a substrate. The cleaning material includes solid components dispersed within a liquid medium. A force is applied to the solid components within the liquid medium to bring the solid components within proximity to contaminants present on the substrate. The force applied to the solid components can be exerted by an immiscible component within the liquid medium. When the solid components are brought within sufficient proximity to the contaminants, an interaction is established between the solid components and the contaminants. Then, the solid components are moved away from the substrate such that the contaminants having interacted with the solid components are removed from the substrate.Type: ApplicationFiled: November 17, 2009Publication date: March 11, 2010Applicant: Lam Research CorporationInventors: Erik M. Freer, John M. de Larios, Katrina Mikhaylichenko, Michael Ravkin, Mikhail Korolik, Fred C. Redeker, Clint Thomas, John Parks
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Patent number: 7648584Abstract: A cleaning material is disposed over a substrate. The cleaning material includes solid components dispersed within a liquid medium. A force is applied to the solid components within the liquid medium to bring the solid components within proximity to contaminants present on the substrate. The force applied to the solid components can be exerted by an immiscible component within the liquid medium. When the solid components are brought within sufficient proximity to the contaminants, an interaction is established between the solid components and the contaminants. Then, the solid components are moved away from the substrate such that the contaminants having interacted with the solid components are removed from the substrate.Type: GrantFiled: January 20, 2006Date of Patent: January 19, 2010Assignee: Lam Research CorporationInventors: Erik M. Freer, John M. de Larios, Katrina Mikhaylichenko, Michael Ravkin, Mikhail Korolik, Fred C. Redeker, Clint Thomas, John Parks
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Publication number: 20090308413Abstract: An apparatus for cleaning a substrate is disclosed. The apparatus having a first head unit and a second head unit. The first head unit is positioned proximate to the surface of the substrate and has a first row of channels defined within configured to supply a foam to the surface of the substrate. The second head unit is positioned substantially adjacent to the first head unit and proximate to the surface of the substrate. A second and a third row of channels are defined within the second head unit. The second row of channels is configured to supply a fluid to the surface of the substrate. The third row of channels is configured to apply a vacuum to the surface of the substrate.Type: ApplicationFiled: September 15, 2006Publication date: December 17, 2009Applicant: LAM RESEARCH CORPORATIONInventors: Erik M. Freer, John M. de Larios, Katrina Mikhaylichenko, Michael Ravkin, Mikhail Korolik, Fred C. Redeker, Clint Thomas, John Parks
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Publication number: 20080251148Abstract: A chemical fluid handling system is defined to supply a number of chemicals to a number of fluid inputs of a mixing manifold. The chemical fluid handling system includes a number of fluid recirculation loops for separately pre-conditioning and controlling the supply of each of the number of chemicals. Each of the fluid recirculation loops is defined to degas, heat, and filter a particular one of the number of chemical components. The mixing manifold is defined to mix the number of chemicals to form the electroless plating solution. The mixing manifold includes a fluid output connected to a supply line. The supply line is connected to supply the electroless plating solution to a fluid bowl within an electroless plating chamber.Type: ApplicationFiled: April 16, 2007Publication date: October 16, 2008Applicant: Lam Research CorporationInventors: William Thie, John M. Boyd, Fritz C. Redeker, Yezdi Dordi, John Parks, Tiruchirapalli Arunagiri, Aleksander Owczarz, Todd Balisky, Clint Thomas, Jacob Wylie
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Publication number: 20080254225Abstract: A semiconductor wafer electroless plating apparatus includes a platen and a fluid bowl. The platen has a top surface defined to support a wafer, and an outer surface extending downward from a periphery of the top surface to a lower surface of the platen. The fluid bowl has an inner volume defined by an interior surface so as to receive the platen, and wafer to be supported thereon, within the inner volume. A seal is disposed around the interior surface of the fluid bowl so as to form a liquid tight barrier when engaged between the interior surface of the fluid bowl and the outer surface of the platen. A number of fluid dispense nozzles are positioned to dispense electroplating solution within the fluid bowl above the seal so as to rise up and flow over the platen, thereby flowing over the wafer when present on the platen.Type: ApplicationFiled: April 16, 2007Publication date: October 16, 2008Applicant: Lam Research CorporationInventors: William Thie, John M. Boyd, Fritz C. Redeker, Yezdi Dordi, John Parks, Tiruchirapalli Arunagiri, Aleksander Owczarz, Todd Balisky, Clint Thomas, Jacob Wylie
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Publication number: 20080254621Abstract: A dry-in/dry-out system is disclosed for wafer electroless plating. The system includes an upper zone for wafer ingress/egress and drying operations. Proximity heads are provided in the upper zone to perform the drying operations. The system also includes a lower zone for electroless plating operations. The lower zone includes an electroless plating apparatus that implements a wafer submersion by fluid upwelling method. The upper and lower zones of the system are enclosed by a dual-walled chamber, wherein the inner wall is a chemically inert plastic and the outer wall is a structural metal. The system interfaces with a fluid handling system which provides the necessary chemistry supply and control for the system. The system is ambient controlled. Also, the system interfaces with an ambient controlled managed transfer module (MTM).Type: ApplicationFiled: April 16, 2007Publication date: October 16, 2008Applicant: Lam Research CorporationInventors: William Thie, John M. Boyd, Fritz C. Redeker, Yezdi Dordi, John Parks, Tiruchirapalli Arunagiri, Aleksander Owczarz, Todd Balisky, Clint Thomas, Jacob Wylie
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Publication number: 20070079848Abstract: A cleaning material is disposed over a substrate. The cleaning material includes solid components dispersed within a liquid medium. A force is applied to the solid components within the liquid medium to bring the solid components within proximity to contaminants present on the substrate. The force applied to the solid components can be exerted by an immiscible component within the liquid medium. When the solid components are brought within sufficient proximity to the contaminants, an interaction is established between the solid components and the contaminants. Then, the solid components are moved away from the substrate such that the contaminants having interacted with the solid components are removed from the substrate.Type: ApplicationFiled: January 20, 2006Publication date: April 12, 2007Applicant: Lam Research CorporationInventors: Erik Freer, John de Larios, Katrina Mikhaylichenko, Michael Ravkin, Mikhail Korolik, Fred Redeker, Clint Thomas, John Parks
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Patent number: 6367357Abstract: Apparatus for engaging and turning spanner type threaded members has an upper jaw member extending from a handle and terminating in a 90° arcuate radiused portion. A cylindrical lug extends radially at the end of the radiused portion for engaging the threaded member, and a clamping jaw member is pivotally connected to the handle so as to be diametrically opposed to the lug. The clamping jaw member is forced toward the upper jaw member to provide a clamping force on the threaded member and force the cylindrical lug into positive engagement with the threaded member.Type: GrantFiled: May 16, 2000Date of Patent: April 9, 2002Inventor: Clint Thomas